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参数资料
| 型号： | ADM00360 |
| 厂商： | Microchip Technology |
| 文件页数： | 20/38页 |
| 文件大小： | 0K |
| 描述： | BOARD DEMO FOR MCP16301 D2PAK |
| 设计资源： | ADM00360 Bill of Materials ADM00360 Schematic |
| 特色产品： | MCP16301 Demo Boards |
| 标准包装： | 1 |
| 主要目的： | DC/DC，步降 |
| 输出及类型： | 1，非隔离 |
| 输出电压： | 3.3V |
| 电流 - 输出： | 300mA |
| 输入电压： | 4 ~ 26 V |
| 稳压器拓扑结构： | 降压 |
| 频率 - 开关： | 500kHz |
| 板类型： | 完全填充 |
| 已供物品： | 板 |
| 已用 IC / 零件： | MCP16301 |
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MCP16301
5.9
Boost Capacitor
EXAMPLE 5-5:
The boost capacitor is used to supply current for the
internal high side drive circuitry that is above the input
voltage. The boost capacitor must store enough energy
to completely drive the high side switch on and off. A
0.1 μF X5R or X7R capacitor is recommended for all
applications. The boost capacitor maximum voltage is
5.5V, so a 6.3V or 10V rated capacitor is recom-
mended.
V IN
V OUT
I OUT
Efficiency
Total System Dissipation
L ESR
= 10V
= 5.0V
= 0.4A
= 90%
= 222 mW
= 0.15 Ω
5.10
Thermal Calculations
P L
Diode VF
= 24 mW
= 0.50
The MCP16301 is available in a SOT-23-6 package. By
calculating the power dissipation and applying the
package thermal resistance ( θ JA ), the junction temper-
D
P Diode
= 50%
= 125 mW
ature is estimated. The maximum continuous junction
temperature rating for the MCP16301 is +125°C.
To quickly estimate the internal power dissipation for
the switching step-down regulator, an empirical calcu-
MCP16301 internal power dissipation estimate:
P DIS - P L - P DIODE = 73 mW
lation using measured efficiency can be used. Given
the measured efficiency, the internal power dissipation
is estimated by Equation 5-7 . This power dissipation
includes all internal and external component losses.
For a quick internal estimate, subtract the estimated
θ JA
Estimated Junction
Temperature Rise
= 198°C/W
= +14.5°C
Schottky diode loss and inductor ESR loss from the
5.11
PCB Layout Information
Good printed circuit board layout techniques are
EQUATION 5-7:
TOTAL POWER
DISSIPATION ESTIMATE
important to any switching circuitry, and switching
power supplies are no different. When wiring the
? ------------------------------ ? – ( V
? Efficiency ?
OUT × I OUT ) = P Dis
switching high-current paths, short and wide traces
should be used. Therefore, it is important that the input
and output capacitors be placed as close as possible to
the MCP16301 to minimize the loop area.
The difference between the first term, input power, and
the second term, power delivered, is the total system
power dissipation. The freewheeling Schottky diode
losses are determined by calculating the average diode
current and multiplying by the diode forward drop. The
inductor losses are estimated by P L = I OUT2 x L ESR .
The feedback resistors and feedback signal should be
routed away from the switching node and the switching
current loop. When possible, ground planes and traces
should be used to help shield the feedback signal and
minimize noise and magnetic interference.
A good MCP16301 layout starts with C IN placement.
EQUATION 5-8:
DIODE POWER
DISSIPATION ESTIMATE
C IN supplies current to the input of the circuit when the
switch is turned on. In addition to supplying high-
frequency switch current, C IN also provides a stable
P Diode = V F × ( ( 1 – D ) × I OUT )
DS25004A-page 20
voltage source for the internal MCP16301 circuitry.
Unstable PWM operation can result if there are
excessive transients or ringing on the V IN pin of the
MCP16301 device. In Figure 5-1 , C IN is placed close to
pin 5. A ground plane on the bottom of the board
provides a low resistive and inductive path for the
return current. The next priority in placement is the
freewheeling current loop formed by D1, C OUT and L,
while strategically placing C OUT return close to C IN
return. Next, C B and D B should be placed between the
boost pin and the switch node pin SW. This leaves
space close to the MCP16301 V FB pin to place R TOP
and R BOT . R TOP and R BOT are routed away from the
Switch node so noise is not coupled into the high-
impedance V FB input.
? 2011 Microchip Technology Inc.
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