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参数资料
型号： ADM233LANZ
厂商： Analog Devices Inc
文件页数： 7/20页
文件大小： 0K
描述： IC TX/RX DUAL RS-232 5VLP 20DIP
标准包装： 18
类型： 收发器
驱动器/接收器数： 4/3
规程： RS232
电源电压： 4.75 V ~ 5.25 V
安装类型： 通孔
封装/外壳： 20-DIP（0.300"，7.62mm）
供应商设备封装： 20-PDIP
包装： 管件
产品目录页面： 789 (CN2011-ZH PDF)
ADM231L–ADM234L/ADM236L–ADM241L
Rev. C | Page 15 of 20
16
18
9
0.310 (7.87)
0.220 (5.59)
PIN 1
0.005
(0.13)
MIN
0.098 (2.49)
MAX
15°
0°
0.320 (8.13)
0.290 (7.37)
0.015 (0.38)
0.008 (0.20)
SEATING
PLANE
0.200 (5.08)
MAX
0.840 (21.34) MAX
0.150 (3.81)
MIN
0.200 (5.08)
0.125 (3.18)
0.023 (0.58)
0.014 (0.36)
0.100
(2.54)
BSC
0.070 (1.78)
0.030 (0.76)
0.060 (1.52)
0.015 (0.38)
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
Figure 36. 16-Lead Ceramic Dual In-Line Package [CERDIP]
(Q-16)
Dimensions shown in inches and (millimeters)
20
1
10
11
0.985 (25.02)
0.965 (24.51)
0.945 (24.00)
0.295 (7.49)
0.285 (7.24)
0.275 (6.99)
0.015 (0.38)
0.010 (0.25)
0.008 (0.20)
0.325 (8.26)
0.310 (7.87)
0.300 (7.62)
SEATING
PLANE
0.015 (0.38) MIN
0.180 (4.57)
MAX
0.022 (0.56)
0.018 (0.46)
0.014 (0.36)
0.150 (3.81)
0.130 (3.30)
0.110 (2.79)
0.100
(2.54)
BSC
0.060 (1.52)
0.050 (1.27)
0.045 (1.14)
0.150 (3.81)
0.135 (3.43)
0.120 (3.05)
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
COMPLIANT TO JEDEC STANDARDS MO-095-AE
Figure 37. 20-Lead Plastic Dual In-Line Package [PDIP]
(N-20)
Dimensions shown in inches and (millimeters)
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
COMPLIANT TO JEDEC STANDARDS MS-013AC
0.75 (0.0295)
0.25 (0.0098)
20
11
10
1
8°
0°
× 45°
1.27 (0.0500)
0.40 (0.0157)
SEATING
PLANE
0.30 (0.0118)
0.10 (0.0039)
0.51 (0.0201)
0.31 (0.0122)
2.65 (0.1043)
2.35 (0.0925)
0.33 (0.0130)
0.20 (0.0079)
1.27
(0.0500)
BSC
10.65 (0.4193)
10.00 (0.3937)
7.60 (0.2992)
7.40 (0.2913)
13.00 (0.5118)
12.60 (0.4961)
COPLANARITY
0.10
Figure 38. 20-Lead Standard Small Outline Package [SOIC]
Wide Body (R-20)
Dimensions shown in millimeters and (inches)
20
110
11
0.310 (7.87)
0.220 (5.59)
PIN 1
0.005
(0.13)
MIN
0.098 (2.49)
MAX
15°
0°
0.320 (8.13)
0.290 (7.37)
0.015 (0.38)
0.008 (0.20)
SEATING
PLANE
0.200 (5.08)
MAX
1.060 (26.92) MAX
0.150 (3.81)
MIN
0.200 (5.08)
0.125 (3.18)
0.023 (0.58)
0.014 (0.36)
0.100
(2.54)
BSC
0.070 (1.78)
0.030 (0.76)
0.060 (1.52)
0.015 (0.38)
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
Figure 39. 20-Lead Ceramic Dual In-Line Package [CERDIP]
(Q-20)
Dimensions shown in inches and (millimeters)
24
112
13
1.185 (30.01)
1.165 (29.59)
1.145 (29.08)
0.295 (7.49)
0.285 (7.24)
0.275 (6.99)
0.150 (3.81)
0.135 (3.43)
0.120 (3.05)
0.015 (0.38)
0.010 (0.25)
0.008 (0.20)
0.325 (8.26)
0.310 (7.87)
0.300 (7.62)
SEATING
PLANE
0.015 (0.38) MIN
0.180
(4.57)
MAX
0.022 (0.56)
0.018 (0.46)
0.014 (0.36)
0.150 (3.81)
0.130 (3.30)
0.110 (2.79)
0.100
(2.54)
BSC
0.060 (1.52)
0.050 (1.27)
0.045 (1.14)
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
COMPLIANT TO JEDEC STANDARDS MO-095AG
Figure 40. 24-Lead Plastic Dual In-Line Package [PDIP]
(N-24-1)
Dimensions shown in inches and (millimeters)
SEATING
PLANE
0.023 (0.58)
0.014 (0.36)
0.075 (1.91)
0.015 (0.38)
0.225 (5.72)
MAX
0.200 (5.08)
0.120 (3.05)
0.070 (1.78)
0.030 (0.76)
0.150
(3.81)
MIN
1.290 (32.77) MAX
0.100 (2.54)
BSC
24
2
1
13
0.610 (15.49)
0.500 (12.70)
PIN 1
0.098 (2.49) MAX
0.005 (0.13) MIN
0.620 (15.75)
0.590 (14.99)
0.015 (0.38)
0.008 (0.20)
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
Figure 41. 24-Lead Side-Brazed Ceramic Dual In-Line Package [SBDIP]
(D-24-2)
Dimensions shown in inches and (millimeters)
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相关代理商/技术参数
参数描述
ADM233LANZ 制造商:Analog Devices 功能描述:IC TRANSCEIVER
ADM233LJN 功能描述:IC TX/RX DUAL RS-232 5VLP 20DIP RoHS:否 类别:集成电路 (IC) >> 接口 - 驱动器，接收器，收发器 系列:- 标准包装:27 系列:- 类型:收发器 驱动器/接收器数:3/3 规程:RS232，RS485 电源电压:4.75 V ~ 5.25 V 安装类型:表面贴装 封装/外壳:28-SOIC（0.295"，7.50mm 宽） 供应商设备封装:28-SOIC 包装:管件
ADM233LJNZ 功能描述:IC TX/RX DUAL RS-232 5VLP 20DIP RoHS:是 类别:集成电路 (IC) >> 接口 - 驱动器，接收器，收发器 系列:- 产品培训模块:RS-232 & USB Transceiver 标准包装:2,000 系列:- 类型:收发器 驱动器/接收器数:1/1 规程:RS232 电源电压:3 V ~ 5.5 V 安装类型:表面贴装 封装/外壳:16-SSOP（0.209"，5.30mm 宽） 供应商设备封装:16-SSOP 包装:带卷 (TR) 其它名称:296-19849-2
ADM233LJNZ 制造商:Analog Devices 功能描述:Transceiver IC
ADM234L 制造商:AD 制造商全称:Analog Devices 功能描述:+5 V Powered CMOS RS-232 Drivers/Receivers
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