参数资料
型号: ADM237LJR-REEL
厂商: Analog Devices Inc
文件页数: 6/20页
文件大小: 0K
描述: IC TXRX RS-232 5:3 5V LP 24SOIC
标准包装: 1,000
类型: 收发器
驱动器/接收器数: 4/3
规程: RS232
电源电压: 4.75 V ~ 5.25 V
安装类型: 表面贴装
封装/外壳: 24-SOIC(0.295",7.50mm 宽)
供应商设备封装: 24-SOIC W
包装: 带卷 (TR)
ADM231L–ADM234L/ADM236L–ADM241L
Rev. C | Page 14 of 20
OUTLINE DIMENSIONS
14
17
8
0.685 (17.40)
0.665 (16.89)
0.645 (16.38)
0.295 (7.49)
0.285 (7.24)
0.275 (6.99)
0.100 (2.54)
BSC
SEATING
PLANE
0.180 (4.57)
MAX
0.022 (0.56)
0.018 (0.46)
0.014 (0.36)
0.150 (3.81)
0.130 (3.30)
0.110 (2.79)
0.060 (1.52)
0.050 (1.27)
0.045 (1.14)
0.015 (0.38)
0.010 (0.25)
0.008 (0.20)
0.325 (8.26)
0.310 (7.87)
0.300 (7.62)
0.015 (0.38)
MIN
0.150 (3.81)
0.135 (3.43)
0.120 (3.05)
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
COMPLIANT TO JEDEC STANDARDS MO-095-AB
Figure 32. 14-Lead Plastic Dual In-Line Package [PDIP]
(N-14)
Dimensions shown in inches and (millimeters)
16
1
8
9
0.295 (7.49)
0.285 (7.24)
0.275 (6.99)
0.100 (2.54)
BSC
SEATING
PLANE
0.015 (0.38)
MIN
0.180 (4.57)
MAX
0.022 (0.56)
0.018 (0.46)
0.014 (0.36)
0.150 (3.81)
0.130 (3.30)
0.110 (2.79)
0.060 (1.52)
0.050 (1.27)
0.045 (1.14)
0.150 (3.81)
0.135 (3.43)
0.120 (3.05)
0.015 (0.38)
0.010 (0.25)
0.008 (0.20)
0.325 (8.26)
0.310 (7.87)
0.300 (7.62)
0.785 (19.94)
0.765 (19.43)
0.745 (18.92)
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
COMPLIANT TO JEDEC STANDARDS MO-095AC
Figure 33. 16-Lead Plastic Dual In-Line Package [PDIP]
(N-16)
Dimensions shown in inches and (millimeters)
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
COMPLIANT TO JEDEC STANDARDS MS-013AA
SEATING
PLANE
0.30 (0.0118)
0.10 (0.0039)
0.51 (0.0201)
0.31 (0.0122)
2.65 (0.1043)
2.35 (0.0925)
1.27 (0.0500)
BSC
16
9
8
1
10.65 (0.4193)
10.00 (0.3937)
7.60 (0.2992)
7.40 (0.2913)
10.50 (0.4134)
10.10 (0.3976)
0.75 (0.0295)
0.25 (0.0098)
× 45°
1.27 (0.0500)
0.40 (0.0157)
0.33 (0.0130)
0.20 (0.0079)
COPLANARITY
0.10
Figure 34. 16-Lead Standard Small Outline Package [SOIC]
Wide Body (R-16)
Dimensions shown in millimeters and (inches)
14
17
8
0.310 (7.87)
0.220 (5.59)
PIN 1
0.005 (0.13) MIN
0.098 (2.49) MAX
0.100 (2.54) BSC
15°
0.320 (8.13)
0.290 (7.37)
0.015 (0.38)
0.008 (0.20)
SEATING
PLANE
0.200 (5.08)
MAX
0.785 (19.94) MAX
0.150
(3.81)
MIN
0.200 (5.08)
0.125 (3.18)
0.023 (0.58)
0.014 (0.36)
0.070 (1.78)
0.030 (0.76)
0.060 (1.52)
0.015 (0.38)
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
Figure 35. 14-Lead Ceramic Dual In-Line Package [CERDIP]
(Q-14)
Dimensions shown in inches and (millimeters)
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