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参数资料
| 型号： | ADM2687EBRIZ-RL7 |
| 厂商： | Analog Devices Inc |
| 文件页数： | 18/24页 |
| 文件大小： | 0K |
| 描述： | IC TXRX ISOLATED RS485 16SOIC |
| 标准包装： | 400 |
| 系列： | isoPower® |
| 类型： | 收发器 |
| 电压 - 隔离： | 5000Vrms |
| 输入类型： | DC |
| 电源电压： | 3.3V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 16-SOIC（0.295"，7.50mm 宽） |
| 供应商设备封装： | 16-SOIC-IC |
| 包装： | 带卷 (TR) |
ADM2682E/ADM2687E
APPLICATIONS INFORMATION
PCB LAYOUT
The ADM2682E / ADM2687E isolated RS-422/RS-485 transceiver
contains an iso Power integrated dc-to-dc converter, requiring
no external interface circuitry for the logic interfaces. Power
supply bypassing is required at the input and output supply pins
ADM2687E uses an 180 MHz oscillator frequency to pass power
efficiently through its chip-scale transformers. In addition, the
normal operation of the data section of the i Coupler introduces
switching transients on the power supply pins.
Bypass capacitors are required for several operating frequencies.
Noise suppression requires a low inductance, high frequency
capacitor, whereas ripple suppression and proper regulation
require a large value capacitor. These capacitors are connected
between Pin 1 (GND 1 ) and Pin 2 (V CC ) and Pin 7 (V CC ) and
Pin 8 (GND 1 ) for V CC . The V ISOIN and V ISOOUT capacitors are
connected between Pin 9 (GND 2 ) and Pin 10 (V ISOOUT ) and
Pin 15 (V ISOIN ) and Pin 16 (GND 2 ). To suppress noise and reduce
ripple, a parallel combination of at least two capacitors is required
with the smaller of the two capacitors located closest to the device.
The recommended capacitor values are 0.1 μF and 10 μF for
V ISOOUT at Pin 9 and Pin 10 and V CC at Pin 7 and Pin 8. Capacitor
values of 0.01 μF and 0.1 μF are recommended for V ISOIN at Pin 15
and Pin 16 and V CC at Pin 1 and Pin 2. The recommended best
practice is to use a very low inductance ceramic capacitor, or its
equivalent, for the smaller value capacitors. The total lead length
between both ends of the capacitor and the input power supply
pin should not exceed 10 mm.
Data Sheet
In applications involving high common-mode transients, ensure
that board coupling across the isolation barrier is minimized.
Furthermore, design the board layout such that any coupling
that does occur equally affects all pins on a given component
side. Failure to ensure this can cause voltage differentials between
pins exceeding the absolute maximum ratings for the device,
thereby leading to latch-up and/or permanent damage.
The ADM2682E / ADM2687E dissipate approximately 675 mW
of power when fully loaded. Because it is not possible to apply
a heat sink to an isolation device, the devices primarily depend
on heat dissipation into the PCB through the GND pins. If the
devices are used at high ambient temperatures, provide a thermal
path from the GND pins to the PCB ground plane. The board
layout in Figure 41 shows enlarged pads for Pin 1, Pin 8, Pin 9,
and Pin 16. Implement multiple vias from the pad to the ground
plane to reduce the temperature inside the chip significantly. The
dimensions of the expanded pads are at the discretion of the
designer and dependent on the available board space.
EMI CONSIDERATIONS
components must, of necessity, operate at very high frequency
to allow efficient power transfer through the small transformers.
This creates high frequency currents that can propagate in circuit
board ground and power planes, causing edge and dipole radiation.
Grounded enclosures are recommended for applications that
use these devices. If grounded enclosures are not possible, good
RF design practices should be followed in the layout of the PCB.
See the AN-0971 Application Note , Recommendations for Control
10nF
100nF
10nF
100nF
of Radiated Emissions with isoPower Devices , for more information.
GND 1
V CC
1
2
16
15
GND 2
V ISOIN
RxD
RE
DE
TxD
V CC
GND 1
3
4
5
6
7
8
ADM2682E/
ADM2687E
14
13
12
11
10
9
A
B
Z
Y
GND 2
V ISOOUT
10μF
100nF
10μF
100nF
Figure 41. Recommended PCB Layout
Rev. B | Page 18 of 24
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相关代理商/技术参数 |
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| ADM2687EBRWZ | 制造商:Analog Devices 功能描述: |
| ADM2795EARWZ | 功能描述:1/1 Transceiver Half RS422, RS485 16-SOIC 制造商:analog devices inc. 系列:- 包装:管件 零件状态:在售 类型:收发器 协议:RS422，RS485 驱动器/接收器数:1/1 双工:半 接收器滞后:30mV 数据速率:2.5Mbps 电压 - 电源:1.7 V ~ 5.5 V 工作温度:-40°C ~ 85°C（TA） 安装类型:表面贴装 封装/外壳:16-SOIC（0.209"，5.30mm 宽） 供应商器件封装:16-SOIC 标准包装:47 |
| ADM2795EARWZ-RL7 | 功能描述:IC TXRX 1/1 RS422/RS485 16-SOIC 制造商:analog devices inc. 系列:- 包装:带卷（TR） 零件状态:在售 类型:收发器 协议:RS422，RS485 驱动器/接收器数:1/1 双工:半 接收器滞后:30mV 数据速率:2.5Mbps 电压 - 电源:1.7 V ~ 5.5 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:16-SOIC（0.209"，5.30mm 宽） 供应商器件封装:16-SOIC 标准包装:400 |
| ADM2795EBRWZ | 功能描述:1/1 Transceiver Half RS422, RS485 制造商:analog devices inc. 系列:- 包装:管件 零件状态:在售 类型:收发器 协议:RS422，RS485 驱动器/接收器数:1/1 双工:半 接收器滞后:30mV 数据速率:2.5Mbps 电压 - 电源:1.7 V ~ 5.5 V 工作温度:-40°C ~ 125°C（TA） 安装类型:* 封装/外壳:* 供应商器件封装:* 标准包装:47 |
| ADM2795EBRWZ-RL7 | 功能描述:IC TXRX 1/1 RS422/RS485 16-SOIC 制造商:analog devices inc. 系列:- 包装:带卷（TR） 零件状态:在售 类型:收发器 协议:RS422，RS485 驱动器/接收器数:1/1 双工:半 接收器滞后:30mV 数据速率:2.5Mbps 电压 - 电源:1.7 V ~ 5.5 V 工作温度:-40°C ~ 125°C 安装类型:表面贴装 封装/外壳:16-SOIC（0.209"，5.30mm 宽） 供应商器件封装:16-SOIC 标准包装:400 |
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