参数资料
| 型号： | ADMP421BCEZ-RL7 |
| 厂商： | Analog Devices Inc |
| 文件页数： | 3/16页 |
| 文件大小： | 0K |
| 描述： | MIC MEMS OMNI-DIR DGTL 5LGA |
| 标准包装： | 1 |
| 系列： | ADMP421 |
| 类型： | MEMS（硅） |
| 输出类型： | 数字，PDM |
| 方向： | 全向 |
| 频率范围： | 100Hz ~ 15kHz |
| 灵敏度： | -26dB ±3dB |
| 信噪比： | 61dB |
| 电压 - 额定： | 1.8 ~ 3.3V |
| 电流 - 电源： | 650µA |
| 端口位置： | 底部 |
| 密封等级： | 无 |
| 端子： | 表面贴装型 |
| 尺寸/尺寸： | 4.00mm L x 3.00mm W |
| 高度（最大）： | 1.10mm |
| 形状： | 矩形 |
| 包装： | 标准包装 |
| 其它名称： | ADMP421BCEZ-RL7DKR |
Data Sheet
ADMP421
Rev. D | Page 11 of 16
HANDLING INSTRUCTIONS
PICK-AND-PLACE EQUIPMENT
The MEMS microphone can be handled using standard pick-
and-place and chip shooting equipment. Care should be taken
to avoid damage to the MEMS microphone structure as follows:
Use a standard pickup tool to handle the microphone.
Because the microphone hole is on the bottom of the
package, the pickup tool can make contact with any part
of the lid surface.
Use care during pick-and-place to ensure that no high
shock events above 10 kg are experienced because such
events may cause damage to the microphone.
Do not pick up the microphone with a vacuum tool that
makes contact with the bottom side of the microphone.
Do not pull air out of or blow air into the microphone port.
Do not use excessive force to place the microphone on
the PCB.
REFLOW SOLDER
For best results, the soldering profile should be in accordance
with the recommendations of the manufacturer of the solder
paste used to attach the MEMS microphone to the PCB. It is
recommended that the solder reflow profile not exceed the limit
conditions specified in Figure 3 and Table 4.
BOARD WASH
When washing the PCB, ensure that water does not make
contact with the microphone port. Blow-off procedures and
ultrasonic cleaning must not be used.
OBSOLETE
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相关代理商/技术参数 |
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