参数资料
型号: ADMP521ACEZ-RL7
厂商: Analog Devices Inc
文件页数: 4/17页
文件大小: 0K
描述: IC MEMS MICROPHONE ULTRA LN 5LGA
标准包装: 1,000
系列: ADMP521
类型: MEMS(硅)
输出类型: 数字
方向: 全向
频率范围: 100Hz ~ 16kHz
灵敏度: -26dB ±3dB
信噪比: 65dB
电压 - 额定: 1.8 ~ 3.3V
电流 - 电源: 1.2mA
端口位置: 底部
密封等级:
端子: 焊盘
尺寸/尺寸: 0.157" L x 0.118" W(4.00mm x 3.00mm)
高度(最大): 0.043"(1.10mm)
形状: 矩形
包装: 带卷 (TR)
Data Sheet
ADMP521
Rev. A | Page 11 of 16
PCB DESIGN AND LAYOUT
The recommended PCB land pattern for the ADMP521 should
be laid out to a 1:1 ratio to the solder pads on the microphone
package, as shown in Figure 15. Take care to avoid applying solder
paste to the sound hole in the PCB. A suggested solder paste
stencil pattern layout is shown in Figure 16.
The response of the ADMP521 is not affected by the PCB hole
size as long as the hole is not smaller than the sound port of the
microphone (0.25 mm, or 0.010”, in diameter). A 0.5 mm to 1 mm
(0.020 inch to 0.040 inch) diameter for the hole is recommended.
Take care to align the hole in the microphone package with the
hole in the PCB. The exact degree of the alignment does not affect
the microphone performance as long as the holes are not partially
or completely blocked.
4× 0.40 × 0.60
(0.30)
0.90
(0.30)
1.70
3.80
(0.30)
0.35
2.80
2× R0.10
(0.30)
0.35
2.05
0.70
1.10
101
41-
0
09
(1.000)
(0.550)
CENTER LINE
Figure 15. Suggested PCB Land Pattern Layout
101
41
-010
1.45
0.9
2.45
0.7
1.525
1.000
0.35
1.849
1.498
0.205 WIDE
0.248 × 0.498 (2×)
0.248 × 1.148 (2×)
0.248 × 0.948 (2×)
1.498 × 0.248
0.398 × 0.298 (4×)
0.362 CUT (3×)
1.17
24°
0.375
CENTER
LINE
Figure 16. Suggested Solder Paste Stencil Pattern Layout
OBSOLETE
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