参数资料
型号: ADP1613-12-EVALZ
厂商: Analog Devices Inc
文件页数: 24/28页
文件大小: 0K
描述: BOARD EVAL FOR ADP1613
设计资源: Powering a 30V DAC from a 3V supply (CN0193)
标准包装: 1
主要目的: DC/DC,步升
输出及类型: 1,非隔离
输出电压: 12V
电流 - 输出: 2A
输入电压: 2.5 ~ 5.5 V
稳压器拓扑结构: 升压
板类型: 完全填充
已供物品:
已用 IC / 零件: ADP1613
产品目录页面: 791 (CN2011-ZH PDF)
相关产品: ADP1613ARMZ-R7DKR-ND - IC REG BOOST SEPIC ADJ 2A 8MSOP
ADP1613ARMZ-R7CT-ND - IC REG BOOST SEPIC ADJ 2A 8MSOP
ADP1613ARMZ-R7TR-ND - IC REG BOOST SEPIC ADJ 2A 8MSOP

ADP1612/ADP1613
Data Sheet
PCB LAYOUT GUIDELINES
For high efficiency, good regulation, and stability, a well-designed
printed circuit board layout is required.
Use the following guidelines when designing printed circuit
boards (also see Figure 34 for a block diagram and Figure 3
for a pin configuration).
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Keep the low ESR input capacitor, C IN (labeled as C7 in
Figure 76), close to VIN and GND. This minimizes noise
injected into the part from board parasitic inductance.
Keep the high current path from C IN (labeled as C7 in
Figure 76) through the L1 inductor to SW and GND as
short as possible.
Keep the high current path from VIN through L1, the
rectifier (D1) and the output capacitor, C OUT (labeled as
C4 in Figure 76) as short as possible.
Keep high current traces as short and as wide as possible.
Place the feedback resistors as close to FB as possible to
prevent noise pickup. Connect the ground of the feedback
network directly to an AGND plane that makes a Kelvin
Figure 76. Example Layout for ADP1612/ADP1613 Boost Application
(Top Layer)
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connection to the GND pin.
Place the compensation components as close as possible to
COMP. Connect the ground of the compensation network
directly to an AGND plane that makes a Kelvin connection
to the GND pin.
Connect the softstart capacitor, C SS (labeled as C1 in
Figure 76) as close to the device as possible. Connect the
ground of the softstart capacitor to an AGND plane that
makes a Kelvin connection to the GND pin.
Avoid routing high impedance traces from the compensa-
tion and feedback resistors near any node connected to SW
or near the inductor to prevent radiated noise injection.
Figure 77. Example Layout for ADP1612/ADP1613 Boost Application
(Bottom Layer)
Rev. D | Page 24 of 28
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