参数资料
型号: ADP1613-BL3-EVZ
厂商: Analog Devices Inc
文件页数: 4/28页
文件大小: 0K
描述: EVAL BLANK ADISIMPOWER ADP1613
标准包装: 1
主要目的: DC/DC,步升
稳压器拓扑结构: 升压
板类型: 裸(未填充)
已供物品: 裸板
已用 IC / 零件: ADP1613

ADP1612/ADP1613
ABSOLUTE MAXIMUM RATINGS
Data Sheet
Table 2.
Parameter
VIN, EN, FB to GND
FREQ to GND
COMP to GND
SS to GND
SW to GND
Operating Junction Temperature Range
Storage Temperature Range
Rating
?0.3 V to +6 V
?0.3 V to V IN + 0.3 V
1.0 V to 1.6 V
?0.3 V to +1.3 V
21 V
?40°C to +125°C
?65°C to +150°C
THERMAL RESISTANCE
Junction-to-ambient thermal resistance (θ JA ) of the package is
specified for the worst-case conditions, that is, a device soldered
in a circuit board for surface-mount packages. The junction-to-
ambient thermal resistance is highly dependent on the application
and board layout. In applications where high maximum power
dissipation exists, attention to thermal board design is required.
The value of θ JA may vary, depending on PCB material, layout,
and environmental conditions.
Soldering Conditions
ESD (Electrostatic Discharge)
Human Body Model
JEDEC J-STD-020
±5 kV
Table 3.
Package Type
8-Lead MSOP
θ JA
θ JC
Unit
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
2-Layer Board 1
4-Layer Board 1
206.9
162.2
44.22
44.22
°C/W
°C/W
rating only; functional operation of the device at these or any
1
Thermal numbers per JEDEC standard JESD 51-7.
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Absolute maximum ratings apply individually only, not in
combination.
BOUNDARY CONDITION
Modeled under natural convection cooling at 25°C ambient
temperature, JESD 51-7, and 1 W power input with 2- and
4-layer boards.
ESD CAUTION
Rev. D | Page 4 of 28
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