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| 型号： | ADP1653ACPZ-R7 |
| 厂商： | Analog Devices Inc |
| 文件页数： | 6/24页 |
| 文件大小： | 0K |
| 描述： | IC LED DRVR PHOTO FLASH 16-LFCSP |
| 标准包装： | 1 |
| 拓扑： | PWM，升压（升压） |
| 输出数： | 1 |
| 内部驱动器： | 是 |
| 类型 - 主要： | 闪灯/白光 |
| 类型 - 次要： | 白色 LED |
| 频率： | 1.2MHz |
| 电源电压： | 3 V ~ 5.5 V |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 16-VFQFN 裸露焊盘，CSP |
| 供应商设备封装： | 16-LFCSP-VQ |
| 包装： | 标准包装 |
| 工作温度： | -40°C ~ 125°C |
| 产品目录页面： | 792 (CN2011-ZH PDF) |
| 其它名称： | ADP1653ACPZ-R7DKR |
ADP1653
ABSOLUTE MAXIMUM RATINGS
Table 3.
THERMAL RESISTANCE
Parameter
V DD , CTRL0/SDA, CTRL1/SCL, INTF, EN,
SETI, SETT, SETF, STR, HPLED to GND
INT, ILED to GND
LX, OUT to GND
PGND to GND
Operating Ambient Temperature Range
Operating Junction Temperature
Storage Temperature Range
Soldering Conditions
Rating
?0.3 V to +6 V
?0.3 V to + (V DD + 0.3 V)
?0.3 V to +12 V
?0.3 V to +0.3 V
?40°C to +125°C 1
125°C
?65°C to +150°C
JEDEC J-STD-020
Junction-to-ambient thermal resistance (θ JA ) of the package is
based on modeling and calculation using a 4-layer board. The
junction-to-ambient thermal resistance is dependent on the
application and board layout. In applications where high maximum
power dissipation exists, attention to thermal board design is
required. The value of θ JA may vary, depending on PCB material,
layout, and environmental conditions. For more information,
see the AN-772 Application Note, A Design and Manufacturing
Guide for the Lead Frame Chip Scale Package (LFCSP).
Table 4. Thermal Resistance
1
In applications where high power dissipation and poor thermal resistance
are present, the maximum ambient temperature may have to be derated.
Maximum ambient temperature (T A(MAX) ) is dependent on the maximum
operating junction temperature (T J(MAXOP) = 125°C), the maximum power
dissipation of the device (P D(MAX) ), and the junction-to-ambient thermal
Parameter
θ JA
Maximum Power Dissipation
Value
44
1
Unit
°C/W
W
resistance of the part/package in the application (θ JA ), using the following
equation: T A(MAX) = T J(MAXOP) ? (θ JA × P D(MAX) ).
BOUNDARY CONDITION
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
Natural convection, 4-layer board, exposed pad soldered to
the PCB.
ESD CAUTION
maximum rating conditions for extended periods may affect
device reliability.
Absolute maximum ratings apply individually only, not in
combination. Unless otherwise specified, all other voltages
are referenced to GND.
Rev. B | Page 6 of 24
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| ADP1653ACPZ-R71 | 制造商:AD 制造商全称:Analog Devices 功能描述:Compact, High Efficiency, High Power Flash/Torch LED Driver with Dual Interface |
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| ADP16550001ACBZR | 制造商:Analog Devices 功能描述: |
| ADP1655ACBZ-R7 | 功能描述:IC LED DRVR BKLGT FLASH 12-WLCSP RoHS:是 类别:集成电路 (IC) >> PMIC - LED 驱动器 系列:- 标准包装:6,000 系列:- 恒定电流:- 恒定电压:- 拓扑:开路漏极，PWM 输出数:4 内部驱动器:是 类型 - 主要:LED 闪烁器 类型 - 次要:- 频率:400kHz 电源电压:2.3 V ~ 5.5 V 输出电压:- 安装类型:表面贴装 封装/外壳:8-VFDFN 裸露焊盘 供应商设备封装:8-HVSON 包装:带卷 (TR) 工作温度:-40°C ~ 85°C 其它名称:935286881118PCA9553TK/02-TPCA9553TK/02-T-ND |
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