参数资料
| 型号： | ADP1707ARDZ-2.5-R7 |
| 厂商： | Analog Devices Inc |
| 文件页数： | 13/20页 |
| 文件大小： | 0K |
| 描述： | IC REG LDO 2.5V 1A 8-SOIC |
| 产品培训模块： | Power Line Monitoring |
| 标准包装： | 1 |
| 稳压器拓扑结构： | 正，固定式 |
| 输出电压： | 2.5V |
| 输入电压： | 最高 5.5V |
| 电压 - 压降（标准）： | 0.365V @ 1A |
| 稳压器数量： | 1 |
| 电流 - 输出： | 1A（最小值） |
| 电流 - 限制（最小）： | 1.1A |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-SOIC（0.154"，3.90mm Width）裸露焊盘 |
| 供应商设备封装： | 8-SOIC-EP |
| 包装： | 标准包装 |
| 其它名称： | ADP1707ARDZ-2.5-R7DKR |
ADP1706/ADP1707/ADP1708
Thermal overload protection is included, which limits the
junction temperature to a maximum of 150°C (typical). Under
extreme conditions (that is, high ambient temperature and
The junction temperature of the ADP1706/ADP1707/ADP1708
can be calculated by
power dissipation) when the junction temperature starts to
rise above 150°C, the output is turned off, reducing the output
current to zero. When the junction temperature drops below
135°C (typical), the output is turned on again and output
current is restored to its nominal value.
T J = T A + ( P D × θ JA )
where:
T A is the ambient temperature.
P D is the power dissipation in the die, given by
P D = [( V IN – V OUT ) × I LOAD ] + ( V IN × I GND )
(3)
(4)
Consider the case where a hard short from OUT to ground
occurs. At first, the ADP1706/ADP1707/ADP1708 reach
current limit so that only 1.5 A is conducted into the short. If
self-heating of the junction becomes great enough to cause its
temperature to rise above 150°C, thermal shutdown activates,
turning off the output and reducing the output current to
zero. As the junction temperature cools and drops below
135°C, the output turns on and conducts 1.5 A into the short,
where:
I LOAD is the load current.
I GND is the ground current.
V IN and V OUT are the input and output voltages, respectively.
Power dissipation due to ground current is quite small and can
be ignored. Therefore, the junction temperature equation
simplifies to the following:
again causing the junction temperature to rise above 150°C.
T J = T A + {[( V IN – V OUT ) × I LOAD ] × θ JA }
(5)
This thermal oscillation between 135°C and 150°C causes a
current oscillation between 1.5 A and 0 A that continues as
long as the short remains at the output.
Current and thermal limit protections are intended to protect
the device against accidental overload conditions. For reliable
operation, device power dissipation should be externally limited
so junction temperatures do not exceed 125°C.
As shown in Equation 5, for a given ambient temperature,
input-to-output voltage differential, and continuous load
current, a minimum copper size requirement exists for the PCB
to ensure the junction temperature does not rise above 125°C.
for different ambient temperatures, load currents, V IN to V OUT
differentials, and areas of PCB copper.
THERMAL CONSIDERATIONS
To guarantee reliable operation, the junction temperature of
the ADP1706/ADP1707/ADP1708 must not exceed 125°C. To
ensure that the junction temperature stays below this maximum
value, the user needs to be aware of the parameters that contrib-
ute to junction temperature changes. These parameters include
ambient temperature, power dissipation in the power device,
and thermal resistance between the junction and ambient air (θ JA ).
The θ JA value is dependent on the package assembly compounds
used and the amount of copper to which the GND pins of the
140
120
100
80
60
40
MAX T J (DO NOT OPERATE ABOVE THIS POINT)
package are soldered on the PCB. Table 5 shows typical θ JA values
of the 8-lead SOIC and 8-lead LFCSP for various PCB copper sizes.
20
0
1mA
10mA
100mA
300mA
500mA
750mA
1A
(LOAD CURRENT)
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
Table 5. Typical θ JA Values
V IN – V OUT (V)
Copper Size (mm 2 )
50
100
300
500
θ JA (°C/W), SOIC
57.6
53.1
52.3
51.3
51.3
θ JA (°C/W), LFCSP
65.9
62.3
61.2
59.7
59.4
Figure 36. 500 mm 2 of PCB Copper, T A = 25°C, SOIC
1
Device soldered to minimum size pin traces.
Rev. 0 | Page 13 of 20
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| ADP1707ARDZ-3.0-R7 | 功能描述:IC REG LDO 3V 1A 8-SOIC RoHS:是 类别:集成电路 (IC) >> PMIC - 稳压器 - 线性 系列:- 标准包装:1 系列:- 稳压器拓扑结构:正，固定式 输出电压:8V 输入电压:10.5 V ~ 23 V 电压 - 压降（标准）:1.7V @ 40mA 稳压器数量:1 电流 - 输出:100mA（最小值） 电流 - 限制（最小）:- 工作温度:0°C ~ 125°C 安装类型:表面贴装 封装/外壳:8-SOIC（0.154"，3.90mm 宽） 供应商设备封装:8-SOIC 包装:剪切带 (CT) 产品目录页面:1075 (CN2011-ZH PDF) 其它名称:296-24390-1 |
| ADP1707ARDZ-3.3-R7 | 功能描述:IC REG LDO 3.3V 1A 8-SOIC RoHS:是 类别:集成电路 (IC) >> PMIC - 稳压器 - 线性 系列:- 产品培训模块:MIC5365/66 Ultra-small LDO Regulators 标准包装:1 系列:- 稳压器拓扑结构:正，固定式 输出电压:3V 输入电压:最高 5.5V 电压 - 压降（标准）:0.155V @ 150mA 稳压器数量:1 电流 - 输出:150mA 电流 - 限制（最小）:200mA 工作温度:-40°C ~ 125°C 安装类型:表面贴装 封装/外壳:4-UDFN 裸露焊盘，4-TMLF? 供应商设备封装:4-TMLF?（1x1） 包装:Digi-Reel® 其它名称:576-3192-6 |
| ADP1707-BL1-EVZ | 制造商:Analog Devices 功能描述:BLANK ADISIMPOWER EVAL ADP1707 - Boxed Product (Development Kits) |
| ADP1708ACPZ-R7 | 功能描述:IC REG LDO ADJ 1A 8-LFCSP RoHS:是 类别:集成电路 (IC) >> PMIC - 稳压器 - 线性 系列:- 产品培训模块:MIC5365/66 Ultra-small LDO Regulators 标准包装:1 系列:- 稳压器拓扑结构:正，固定式 输出电压:3V 输入电压:最高 5.5V 电压 - 压降（标准）:0.155V @ 150mA 稳压器数量:1 电流 - 输出:150mA 电流 - 限制（最小）:200mA 工作温度:-40°C ~ 125°C 安装类型:表面贴装 封装/外壳:4-UDFN 裸露焊盘，4-TMLF? 供应商设备封装:4-TMLF?（1x1） 包装:Digi-Reel® 其它名称:576-3192-6 |
| ADP1708ARDZ | 制造商:Analog Devices 功能描述:LDO 1A CMOS ADJ V 8SOIC 制造商:Analog Devices 功能描述:LDO, 1A, CMOS, ADJ, V, 8SOIC 制造商:Analog Devices 功能描述:LDO, 1A, CMOS, ADJ, V, 8SOIC; Primary Input Voltage:5.5V; Dropout Voltage Vdo:345mV; Voltage Regulator Case Style:SOIC; No. of Pins:8; Output Current:1A; Operating Temperature Min:-40C; Operating Temperature Max:125C; MSL:MSL 3 - ;RoHS Compliant: Yes |
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