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参数资料
| 型号： | ADP1715ARMZ-1.05R7 |
| 厂商： | Analog Devices Inc |
| 文件页数： | 13/20页 |
| 文件大小： | 0K |
| 描述： | IC REG LDO 1.05V .5A 8-MSOP |
| 产品培训模块： | Power Line Monitoring |
| 标准包装： | 1 |
| 稳压器拓扑结构： | 正，固定式 |
| 输出电压： | 1.05V |
| 输入电压： | 2.5 V ~ 5.5 V |
| 稳压器数量： | 1 |
| 电流 - 输出： | 500mA（最小值） |
| 电流 - 限制（最小）： | 550mA |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-TSSOP，8-MSOP（0.118"，3.00mm 宽） |
| 供应商设备封装： | 8-MSOP |
| 包装： | 标准包装 |
| 其它名称： | ADP1715ARMZ-1.05R7DKR |
ADP1715/ADP1716
should be aware of the parameters that contribute to junction
temperature changes. These parameters include ambient
140
120
DO NOT OPERATE ABOVE THIS POINT
temperature, power dissipation in the power device, and thermal
resistances between the junction and ambient air (θ JA ). The θ JA
number is dependent on the package assembly compounds used
and the amount of copper to which the GND pins of the package
are soldered to on the PCB. Table 5 shows typical θ JA values of the
8-lead thermally enhanced MSOP package for various PCB
copper sizes.
100
80
60
40
MAX T J
Table 5.
20
1mA
50mA
250mA
500mA
Copper Size (mm )
2
θ JA (°C/W)
0
10mA
100mA
360mA
(LOAD CURRENT)
0 1
118
0
1
2
3
4
5
100
300
500
700
99
77
75
74
140
V IN – V OUT (V)
Figure 34. 700 mm 2 of PCB Copper, T A = 25°C
DO NOT OPERATE ABOVE THIS POINT
1
Device soldered to minimum size pin traces.
120
MAX T J
The junction temperature of the ADP1715/ADP1716 can be
calculated from the following equation:
100
80
T J = T A + ( P D × θ JA )
(3)
60
where:
40
T A is the ambient temperature.
P D is the power dissipation in the die, given by
20
1mA
50mA
250mA
500mA
P D = [( V IN – V OUT ) × I LOAD ] + ( V IN × I GND )
(4)
0
0
10mA
1
100mA
2
360mA
3
(LOAD CURRENT)
4
5
where:
V IN – V OUT (V)
Figure 35. 300 mm 2 of PCB Copper, T A = 25°C
I LOAD is the load current.
I GND is ground current.
V IN and V OUT are input and output voltages, respectively.
Power dissipation due to ground current is quite small and can
be ignored. Therefore, the junction temperature equation
simplifies to the following:
140
120
100
80
DO NOT OPERATE ABOVE THIS POINT
MAX T J
T J = T A + {[( V IN – V OUT ) × I LOAD ] × θ JA }
(5)
60
As shown in Equation 5, for a given ambient temperature, input
to output voltage differential, and continuous load current,
there exists a minimum copper size requirement for the PCB to
40
20
ensure the junction temperature does not rise above 125°C. The
1mA
10mA
50mA
100mA
250mA
360mA
500mA
(LOAD CURRENT)
following figures show junction temperature calculations for
0
0
1
2
3
4
5
different ambient temperatures, load currents, V IN to V OUT
differentials, and areas of PCB copper.
Rev. 0 | Page 13 of 20
V IN – V OUT (V)
Figure 36. 100 mm 2 of PCB Copper, T A = 25°C
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| ADP1715ARMZ-2.5 | 制造商:Analog Devices 功能描述:V REG LDO 0.5A 2.5V SMD MSOP8 |
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| ADP1715ARMZ-3.0 | 制造商:Analog Devices 功能描述:V REG LDO 0.5A 3.0V SMD MSOP8 |
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| ADP1715ARMZ-3.3 | 制造商:Analog Devices 功能描述:V REG LDO 0.5A 3.3V SMD MSOP8 制造商:Analog Devices 功能描述:V REG, LDO 0.5A 3.3V, SMD, MSOP8 |
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