参数资料
| 型号： | ADP1715ARMZ-R7 |
| 厂商： | Analog Devices Inc |
| 文件页数： | 15/20页 |
| 文件大小： | 0K |
| 描述： | IC REG LDO ADJ .5A 8MSOP |
| 产品培训模块： | Power Line Monitoring |
| 标准包装： | 1 |
| 稳压器拓扑结构： | 正，可调式 |
| 输出电压： | 0.8 V ~ 5 V |
| 输入电压： | 2.5 V ~ 5.5 V |
| 电压 - 压降（标准）： | 0.32V @ 500mA |
| 稳压器数量： | 1 |
| 电流 - 输出： | 500mA（最小值） |
| 电流 - 限制（最小）： | 550mA |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-TSSOP，8-MSOP（0.118"，3.00mm 宽） |
| 供应商设备封装： | 8-MSOP |
| 包装： | 标准包装 |
| 产品目录页面： | 794 (CN2011-ZH PDF) |
| 配用： | ADP1715-EVALZ-ND - BOARD EVALUATION FOR ADP1715 ADP1715-3.3-EVALZ-ND - BOARD EVAL FOR ADP1715-3.3 ADP1715-1.8-EVALZ-ND - BOARD EVAL FOR ADP1715-1.8 |
| 其它名称： | ADP1715ARMZ-R7DKR |
ADP1715/ADP1716
140
120
100
80
60
MAX T J
DO NOT OPERATE ABOVE THIS POINT
PRINTED CIRCUIT BOARD LAYOUT
CONSIDERATIONS
The 8-lead MSOP package has the four GND pins fused together
internally, which enhances its thermal characteristics. Heat
dissipation from the package is increased by connecting as much
copper as possible to the four GND pins of the ADP1715/
ADP1716. From Table 5 it can be seen that a point of
diminishing returns eventually is reached, beyond which an
40
20
increase in the copper size does not yield additional heat
dissipation benefits.
0
0
1mA
10mA
1
50mA
100mA
2
250mA
360mA
3
500mA
(LOAD CURRENT)
4
5
The four GND pins are connected to a large copper pad. If a
Figure 43. 300 mm of PCB Copper, T A = 85°C
140
V IN – V OUT (V)
2
DO NOT OPERATE ABOVE THIS POINT
second layer is available, multiple vias can be used to connect
them, increasing the overall copper area. The input capacitor
should be placed as close as possible to the IN and GND pins.
The output capacitor should be placed as close as possible to the
120
100
MAX T J
OUT and GND pins. 0603 or 0402 size capacitors and resistors
should be used to achieve the smallest possible footprint
solution on boards where area is limited.
80
GND (TOP)
60
40
20
1mA
50mA
250mA
500mA
0
0
10mA
1
100mA
2
360mA
3
(LOAD CURRENT)
4
5
C1
ADP1715/
ADP1716
C2
V IN – V OUT (V)
Figure 44. 100 mm 2 of PCB Copper, T A = 85°C
140
120
100
80
60
40
DO NOT OPERATE ABOVE THIS POINT
MAX T J
IN
GND (BOTTOM)
EN
C3
R1
OUT
R2
Figure 46. Example PCB Layout
20
1mA
10mA
50mA
100mA
250mA
360mA
500mA
(LOAD CURRENT)
0
0
1
2
3
4
5
V IN – V OUT (V)
Figure 45. 0 mm 2 of PCB Copper, T A = 85°C
Rev. 0 | Page 15 of 20
相关PDF资料 |
PDF描述 |
|---|---|
| ADP1720ARMZ-R7 | IC REG LDO ADJ 50MA 8-MSOP |
| ADP1720TRMZ-EP | IC REG LDO ADJ 50MA 8-MSOP |
| ADP172ACBZ-2.9-R7 | IC REG LDO 2.9V .3A 4WLCSP |
| ADP1740ACPZ-1.1-R7 | IC REG LDO 1.1V 2A 16LFCSP |
| ADP1752ACPZ-1.8-R7 | IC REG LDO 1.8V .8A 16LFCSP |
相关代理商/技术参数 |
参数描述 |
|---|---|
| ADP1715-BL1-EVZ | 制造商:Analog Devices 功能描述:BLANK ADISIMPOWER EVAL ADP1715 - Boxed Product (Development Kits) |
| ADP1715-EVALZ | 功能描述:BOARD EVALUATION FOR ADP1715 RoHS:是 类别:编程器，开发系统 >> 评估板 - 线性稳压器 (LDO) 系列:- 产品变化通告:1Q2012 Discontinuation 30/Mar/2012 设计资源:NCP590MNDPTAGEVB Gerber Files 标准包装:1 系列:- 每 IC 通道数:2 - 双 输出电压:1.8V，2.8V 电流 - 输出:300mA 输入电压:2.1 ~ 5.5 V 稳压器类型:正，固定式 工作温度:-40°C ~ 85°C 板类型:完全填充 已供物品:板 已用 IC / 零件:NCP590MNDP 其它名称:NCP590MNDPTAGEVB-NDNCP590MNDPTAGEVBOS |
| ADP1716 | 制造商:AD 制造商全称:Analog Devices 功能描述:500 mA, Low Dropout, CMOS Linear Regulator |
| ADP1716-2.5-EVALZ | 功能描述:BOARD EVAL FOR ADP1716-2.5 RoHS:是 类别:编程器，开发系统 >> 评估板 - 线性稳压器 (LDO) 系列:- 产品变化通告:1Q2012 Discontinuation 30/Mar/2012 设计资源:NCP590MNDPTAGEVB Gerber Files 标准包装:1 系列:- 每 IC 通道数:2 - 双 输出电压:1.8V，2.8V 电流 - 输出:300mA 输入电压:2.1 ~ 5.5 V 稳压器类型:正，固定式 工作温度:-40°C ~ 85°C 板类型:完全填充 已供物品:板 已用 IC / 零件:NCP590MNDP 其它名称:NCP590MNDPTAGEVB-NDNCP590MNDPTAGEVBOS |
| ADP1716ARMZ-0.75R7 | 功能描述:IC REG LDO 0.75V .5A 8MSOP RoHS:是 类别:集成电路 (IC) >> PMIC - 稳压器 - 线性 系列:- 标准包装:1 系列:- 稳压器拓扑结构:正，固定式 输出电压:3.3V 输入电压:2.5 V ~ 5.5 V 电压 - 压降（标准）:0.1V @ 200mA 稳压器数量:2 电流 - 输出:300mA 电流 - 限制（最小）:350mA 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:8-UFQFN 供应商设备封装:8-MLPQ-UT（1.5x1.5） 包装:剪切带 (CT) 产品目录页面:1358 (CN2011-ZH PDF) 其它名称:SC560HULCT |
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