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参数资料
| 型号： | ADP1752ACPZ-2.5-R7 |
| 厂商： | Analog Devices Inc |
| 文件页数： | 5/20页 |
| 文件大小： | 0K |
| 描述： | IC REG LDO 2.5V .8A 16LFCSP |
| 标准包装： | 1 |
| 稳压器拓扑结构： | 正，固定式 |
| 输出电压： | 2.5V |
| 输入电压： | 最高 3.6V |
| 电压 - 压降（标准）： | 0.07V @ 800mA |
| 稳压器数量： | 1 |
| 电流 - 输出： | 800mA（最小值） |
| 电流 - 限制（最小）： | 1A |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 16-VQFN 裸露焊盘，CSP |
| 供应商设备封装： | 16-LFCSP-VQ EP（4x4） |
| 包装： | 标准包装 |
| 其它名称： | ADP1752ACPZ-2.5-R7DKR |
Data Sheet
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter Rating
VIN to GND ?0.3 V to +4.0 V
VOUT to GND ?0.3 V to V IN
EN to GND ?0.3 V to V IN
SS to GND ?0.3 V to V IN
PG to GND ?0.3 V to +4.0 V
SENSE/ADJ to GND ?0.3 V to V IN
Storage Temperature Range ?65°C to +150°C
Junction Temperature Range ?40°C to +125°C
Junction Temperature 150°C
Soldering Conditions JEDEC J-STD-020
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL DATA
Absolute maximum ratings apply individually only, not in
combination. The ADP1752 / ADP1753 may be damaged if the
junction temperature limits are exceeded. Monitoring ambient
temperature does not guarantee that T J is within the specified
temperature limits. In applications with high power dissipation
and poor thermal resistance, the maximum ambient tempera-
ture may need to be derated. In applications with moderate
power dissipation and low PCB thermal resistance, the maximum
ambient temperature can exceed the maximum limit as long as
the junction temperature is within specification limits. The
junction temperature (T J ) of the device is dependent on the
ambient temperature (T A ), the power dissipation of the device
(P D ), and the junction-to-ambient thermal resistance of the
package (θ JA ). T J is calculated using the following formula:
T J = T A + ( P D × θ JA ).
ADP1752/ADP1753
Junction-to-ambient thermal resistance (θ JA ) of the package is
based on modeling and calculation using a 4-layer board. The
junction-to-ambient thermal resistance is highly dependent on
the application and board layout. In applications where high
maximum power dissipation exists, close attention to thermal
board design is required. The value of θ JA may vary, depending
on PCB material, layout, and environmental conditions. The
specified values of θ JA are based on a 4-layer, 4 in × 3 in circuit
board. Refer to JEDEC JESD51-7 for detailed information about
board construction. For more information, see the AN-772
Ψ JB is the junction-to-board thermal characterization parameter
with units of °C/W. Ψ JB of the package is based on modeling and
calculation using a 4-layer board. The JESD51-12 document,
Guidelines for Reporting and Using Electronic Package Thermal
Information , states that thermal characterization parameters are
not the same as thermal resistances. Ψ JB measures the component
power flowing through multiple thermal paths rather than
through a single path as in thermal resistance, θ JB . Therefore,
Ψ JB thermal paths include convection from the top of the package
as well as radiation from the package, factors that make Ψ JB more
useful in real-world applications. Maximum junction temperature
(T J ) is calculated from the board temperature (T B ) and the power
dissipation (P D ) using the following formula:
T J = T B + ( P D × Ψ JB )
Refer to the JEDEC JESD51-8 and JESD51-12 documents for more
detailed information about Ψ JB .
THERMAL RESISTANCE
θ JA and Ψ JB are specified for the worst-case conditions, that is, a
device soldered in a circuit board for surface-mount packages.
Table 4. Thermal Resistance
Package Type θ JA Ψ JB Unit
16-Lead LFCSP with Exposed Pad (CP-16-4) 42 25.5 °C/W
ESD CAUTION
Rev. F | Page 5 of 20
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相关代理商/技术参数 |
参数描述 |
|---|---|
| ADP1752-BL1-EVZ | 制造商:Analog Devices 功能描述:BLANK ADISIMPOWER EVAL ADP1752 - Boxed Product (Development Kits) |
| ADP1753ACPZ-R7 | 功能描述:IC REG LDO ADJ .8A 16LFCSP RoHS:是 类别:集成电路 (IC) >> PMIC - 稳压器 - 线性 系列:- 标准包装:75 系列:- 稳压器拓扑结构:正，可调式 输出电压:1.2 V ~ 37 V 输入电压:4.2 V ~ 40 V 电压 - 压降（标准）:- 稳压器数量:1 电流 - 输出:500mA 电流 - 限制（最小）:500mA 工作温度:-40°C ~ 125°C 安装类型:表面贴装 封装/外壳:TO-252-3，DPak（2 引线+接片），SC-63 供应商设备封装:TO-252-3 包装:管件 产品目录页面:1286 (CN2011-ZH PDF) 其它名称:*LM317AMDT/NOPBLM317AMDT |
| ADP1753-BL1-EVZ | 制造商:Analog Devices 功能描述:BLANK ADISIMPOWER EVAL ADP1753 - Boxed Product (Development Kits) |
| ADP1753-EVALZ | 制造商:AD 制造商全称:Analog Devices 功能描述:0.8 A, Low VIN, Low Dropout Linear Regulator |
| ADP1754 | 制造商:AD 制造商全称:Analog Devices 功能描述:1.2 A, Low VIN, Low Dropout Linear Regulator |
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