参数资料
型号: ADP1874-0.3-EVALZ
厂商: Analog Devices Inc
文件页数: 6/44页
文件大小: 0K
描述: BOARD EVAL FOR ADP1874
标准包装: 1
系列: *

ADP1874/ADP1875
ABSOLUTE MAXIMUM RATINGS
Table 2.
THERMAL RESISTANCE
Data Sheet
Parameter
VREG, VREG_IN, TRACK to PGND, GND
Rating
?0.3 V to +6 V
θ JA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
VIN, EN, PGOOD to PGND
FB, COMP, RES, SS to GND
DRVL to PGND
SW to PGND
BST to SW
?0.3 V to +28 V
?0.3 V to (VREG + 0.3 V)
?0.3 V to (VREG + 0.3 V)
?2.0 V to +28 V
?0.6 V to (VREG + 0.3 V)
Table 3. Thermal Resistance
Package Type
θ JA (16-Lead QSOP)
4-Layer Board
θ JA
104°
Unit
°C/W
BST to PGND
?0.3 V to +28 V
DRVH to SW
PGND to GND
PGOOD Input Current
θ JA (16-Lead QSOP)
4-Layer Board
Operating Junction Temperature Range
Storage Temperature Range
Soldering Conditions
Maximum Soldering Lead Temperature
?0.3 V to VREG
±0.3 V
20 mA
104°C/W
?40°C to +125°C
?65°C to +150°C
JEDEC J-STD-020
300°C
BOUNDARY CONDITION
In determining the values given in Table 2 and Table 3, natural
convection is used to transfer heat to a 4-layer evaluation board.
ESD CAUTION
(10 sec)
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Absolute maximum ratings apply individually only, not in
combination. Unless otherwise specified, all other voltages
are referenced to PGND.
Rev. A | Page 6 of 44
相关PDF资料
PDF描述
195D685X0010V2T CAP TANT 6.8UF 10V 20% 1410
R1D10-1509/P-R CONV DC/DC 1W 15VIN +/-09VOUT
GBC20DCMT-S288 CONN EDGECARD 40POS .100 EXTEND
EBC24DCST-S288 CONN EDGECARD 48POS .100 EXTEND
EBC22DCMT-S288 CONN EDGECARD 44POS .100 EXTEND
相关代理商/技术参数
参数描述
ADP1874-1.0-EVALZ 功能描述:BOARD EVAL FOR ADP1874 RoHS:是 类别:编程器,开发系统 >> 评估板 - DC/DC 与 AC/DC(离线)SMPS 系列:* 产品培训模块:Obsolescence Mitigation Program 标准包装:1 系列:True Shutdown™ 主要目的:DC/DC,步升 输出及类型:1,非隔离 功率 - 输出:- 输出电压:- 电流 - 输出:1A 输入电压:2.5 V ~ 5.5 V 稳压器拓扑结构:升压 频率 - 开关:3MHz 板类型:完全填充 已供物品:板 已用 IC / 零件:MAX8969
ADP1874ARQZ-0.3-R7 功能描述:IC REG CTRLR BUCK PWM CM 16-QSOP RoHS:是 类别:集成电路 (IC) >> PMIC - 稳压器 - DC DC 切换控制器 系列:- 特色产品:LM3753/54 Scalable 2-Phase Synchronous Buck Controllers 标准包装:1 系列:PowerWise® PWM 型:电压模式 输出数:1 频率 - 最大:1MHz 占空比:81% 电源电压:4.5 V ~ 18 V 降压:是 升压:无 回扫:无 反相:无 倍增器:无 除法器:无 Cuk:无 隔离:无 工作温度:-5°C ~ 125°C 封装/外壳:32-WFQFN 裸露焊盘 包装:Digi-Reel® 产品目录页面:1303 (CN2011-ZH PDF) 其它名称:LM3754SQDKR
ADP1874ARQZ-0.6-R7 功能描述:IC REG CTRLR BUCK PWM CM 16-QSOP RoHS:是 类别:集成电路 (IC) >> PMIC - 稳压器 - DC DC 切换控制器 系列:- 标准包装:2,500 系列:- PWM 型:电流模式 输出数:1 频率 - 最大:500kHz 占空比:96% 电源电压:4 V ~ 36 V 降压:无 升压:是 回扫:无 反相:无 倍增器:无 除法器:无 Cuk:无 隔离:无 工作温度:-40°C ~ 125°C 封装/外壳:24-WQFN 裸露焊盘 包装:带卷 (TR)
ADP1874ARQZ-1.0-R7 功能描述:IC REG CTRLR BUCK PWM CM 16-QSOP RoHS:是 类别:集成电路 (IC) >> PMIC - 稳压器 - DC DC 切换控制器 系列:- 标准包装:2,500 系列:- PWM 型:电流模式 输出数:1 频率 - 最大:500kHz 占空比:96% 电源电压:4 V ~ 36 V 降压:无 升压:是 回扫:无 反相:无 倍增器:无 除法器:无 Cuk:无 隔离:无 工作温度:-40°C ~ 125°C 封装/外壳:24-WQFN 裸露焊盘 包装:带卷 (TR)
ADP1875 制造商:AD 制造商全称:Analog Devices 功能描述:Synchronous Buck Controller with Constant On-Time and Valley Current Mode