参数资料
型号: ADP2106ACPZ-3.3-R7
厂商: Analog Devices Inc
文件页数: 2/36页
文件大小: 0K
描述: IC REG BUCK SYNC 3.3V 16LFCSP
产品培训模块: Powering 90nm/65nm FPGAs and Processors
标准包装: 1
类型: 降压(降压)
输出类型: 固定
输出数: 1
输出电压: 3.3V
输入电压: 2.7 V ~ 5.5 V
PWM 型: 电流模式
频率 - 开关: 1.2MHz
电流 - 输出: 1.5A
同步整流器:
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 16-VQFN 裸露焊盘,CSP
包装: 标准包装
供应商设备封装: 16-LFCSP-VQ
产品目录页面: 791 (CN2011-ZH PDF)
配用: ADP2106-EVALZ-ND - BOARD EVALUATION FOR ADP2106
ADP2106-1.8-EVALZ-ND - BOARD EVAL FOR ADP2106-1.8
其它名称: ADP2106ACPZ-3.3-R7DKR

ADP2105/ADP2106/ADP2107
TABLE OF CONTENTS
REVISION HISTORY
8/12—Rev. C to Rev. D
Change to Features Section ............................................................. 1
Added Exposed Pad Notation to Pin Configuration and
Function Description Section ......................................................... 7
Added ADIsimPower Design Tool Section ................................. 16
Updated Outline Dimensions ....................................................... 33
9/08—Rev. B to Rev. C
Changes to Table Summary Statement .......................................... 4
Changes to LX Minimum On-Time Parameter, Table 1 ............. 5
7/08—Rev. A to Rev. B
Changes to General Description Section ...................................... 1
Changes to Figure 3 .......................................................................... 3
Changes to Table 1 ............................................................................ 4
Changes to Table 2 ............................................................................ 6
Changes to Figure 4 .......................................................................... 7
Changes to Table 4 ............................................................................ 7
Changes to Figure 26 ...................................................................... 11
Changes to Figure 31 Through Figure 34 .................................... 12
Changes to Figure 35 ...................................................................... 13
Changes to PMW Mode Operation Section and Pulse Skipping
Threshold Section ........................................................................... 14
Data Sheet
Changes to Slope Compensation Section.................................... 15
Changes to Setting the Output Voltage Section ........................ 16
Changes to Figure 37...................................................................... 16
Changes to Inductor Selection Section........................................ 17
Changes to Input Capacitor Selection Section ........................... 18
Changes to Figure 47 through Figure 52 ..................................... 21
Changes to Transition Losses Section and Thermal
Considerations Section .................................................................. 22
Changes to Table 11 ....................................................................... 25
Changes to Circuit Board Layout Recommendations Section..27
Changes to Table 12 ....................................................................... 26
Changes to Figure 53...................................................................... 28
Changes to Figure 56 Through Figure 57.................................... 30
Changes to Figure 58 Through Figure 59.................................... 31
Changes to Outline Dimensions .................................................. 33
3/07—Rev. 0 to Rev. A
Updated Format .................................................................. Universal
Changes to Output Characteristics and
LX (Switch Node) Characteristics Sections ...................................3
Changes to Typical Performance Characteristics Section ...........7
Changes to Load Transient Response Section ............................ 21
7/06—Revision 0: Initial Version
Rev. D | Page 2 of 36
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