参数资料
型号: ADP2108AUJZ-1.1-R7
厂商: Analog Devices Inc
文件页数: 4/20页
文件大小: 0K
描述: IC REG BUCK SYNC 1.1V TSOT23-5
标准包装: 1
类型: 降压(降压)
输出类型: 固定
输出数: 1
输出电压: 1.1V
输入电压: 2.3 V ~ 5.5 V
PWM 型: 电流模式
频率 - 开关: 3MHz
电流 - 输出: 600mA
同步整流器:
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: SOT-23-5 细型,TSOT-23-5
包装: 标准包装
供应商设备封装: TSOT-23-5
其它名称: ADP2108AUJZ-1.1-R7DKR

ADP2108
ABSOLUTE MAXIMUM RATINGS
Table 2.
Data Sheet
In applications with moderate power dissipation and low PCB
Parameter
VIN, EN
FB, SW to GND
Operating Ambient Temperature Range
Operating Junction Temperature Range
Storage Temperature Range
Lead Temperature Range
Soldering (10 sec)
Vapor Phase (60 sec)
Infrared (15 sec)
ESD Human Body Model
ESD Charged Device Model
ESD Machine Model
Rating
?0.4 V to +6.5 V
?1.0 V to (V IN + 0.2 V)
?40°C to +125°C
?40°C to +125°C
?65°C to +150°C
?65°C to +150°C
300°C
215°C
220°C
±1500 V
±500 V
±100 V
thermal resistance, the maximum ambient temperature can
exceed the maximum limit as long as the junction temperature
is within specification limits. The junction temperature (T J )
of the device is dependent on the ambient temperature (T A ),
the power dissipation (P D ) of the device, and the junction-to-
ambient thermal resistance of the package (θ JA ). Maximum
junction temperature (T J ) is calculated from the ambient
temperature (T A ) and power dissipation (P D ) using the formula
T J = T A + (P D × θ JA ).
THERMAL RESISTANCE
θ JA is specified for a device mounted on a JEDEC 2S2P PCB.
Table 3. Thermal Resistance
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
Package Type
5-Ball WLCSP
5-Lead TSOT
θ JA
105
170
Unit
°C/W
°C/W
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
ESD CAUTION
device reliability.
Absolute maximum ratings apply individually only, not in
combination. Unless otherwise specified, all other voltages
are referenced to GND.
The ADP2108 can be damaged when the junction temperature
limits are exceeded. Monitoring ambient temperature does not
guarantee that T J is within the specified temperature limits.
In applications with high power dissipation and poor thermal
resistance, the maximum ambient temperature may have to
be derated.
Rev. G | Page 4 of 20
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