参数资料
型号: ADP2109ACBZ-1.8-R7
厂商: Analog Devices Inc
文件页数: 4/16页
文件大小: 0K
描述: IC REG BUCK SYNC 1.8V .6A 5WLCSP
产品变化通告: 8mm Carrier Tape Changes 28/Feb/2012
标准包装: 1
类型: 降压(降压)
输出类型: 固定
输出数: 1
输出电压: 1.8V
输入电压: 2.3 V ~ 5.5 V
PWM 型: 电流模式
频率 - 开关: 3MHz
电流 - 输出: 600mA
同步整流器:
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 5-WFBGA,WLCSP
包装: 标准包装
供应商设备封装: 5-WLCSP
产品目录页面: 791 (CN2011-ZH PDF)
配用: ADP2109CB-1.8EVALZ-ND - BOARD EVAL FOR 1.8V ADP2109
其它名称: ADP2109ACBZ-1.8-R7DKR

ADP2109
ABSOLUTE MAXIMUM RATINGS
Data Sheet
Table 3.
Parameter
VIN, EN
FB, SW to GND
Operating Ambient Temperature Range
Operating Junction Temperature Range
Storage Temperature Range
Lead Temperature Range
Soldering Conditions
Rating
?0.4 V to +6.5 V
?1.0 V to (V IN + 0.2 V)
?40°C to +85°C
?40°C to +125°C
?65°C to +150°C
?65°C to +150°C
JEDEC J-STD-020
The ADP2109 can be damaged when the junction temperature
limits are exceeded. Monitoring ambient temperature does not
guarantee that the junction temperature (T J ) is within the specified
temperature limits. In applications with high power dissipation
and poor thermal resistance, the maximum ambient tempera-
ture may have to be derated. In applications with moderate
power dissipation and low PCB thermal resistance, the max-
imum ambient temperature can exceed the maximum limit
as long as T J is within specification limits. T J of the device is
dependent on the ambient temperature (T A ) of the device,
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Absolute maximum ratings apply individually only, not in
combination. Unless otherwise specified, all other voltages are
referenced to GND.
the power dissipation (PD) of the device, and the junction-to-
ambient thermal resistance (θ JA ) of the package. Maximum T J
is calculated from T A and PD using the following formula:
T J = T A + ( PD × θ JA )
THERMAL RESISTANCE
θ JA is specified for a device mounted on a JEDEC 2S2P PCB.
Table 4. Thermal Resistance
Package Type θ JA Unit
5-Ball WLCSP 105 °C/W
ESD CAUTION
Rev. B | Page 4 of 16
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