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参数资料
| 型号： | ADP2127-1.26-EVALZ |
| 厂商： | Analog Devices Inc |
| 文件页数： | 5/20页 |
| 文件大小： | 0K |
| 描述： | BOARD EVAL FOR ADP2127 1.2VOUT |
| 标准包装： | 1 |
| 系列： | * |
Data Sheet
ABSOLUTE MAXIMUM RATINGS
ADP2126/ADP2127
Table 2.
Parameter
VIN to GND
EXTCLK to GND
SW, MODE to GND
FB to GND
Rating
?0.3 V to +6 V
?0.3 V to +6 V
?0.3 V to VIN
?0.3 V to +3.6 V
ambient temperature can exceed the maximum limit as long as
the junction temperature is within specification limits.
The operating junction temperature (T J ) of the device is dependent
on the ambient temperature (T A ), the power dissipation of the
device (P D ), and the junction-to-ambient thermal resistance of
the package (θ JA ). T J is calculated using the following formula:
Operating Ambient Temperature (T A )
–40°C to +85°C 1
T J = T A + ( P D × θ JA )
(1)
Operating Junction Temperature (T J )
at I LOAD = 500 mA
Soldering Conditions
–40°C to +125°C
JEDEC J-STD-020
See the Applications Information section for further information
on calculating the operating junction temperature for a specific
application.
1
The maximum operating junction temperature (T J (MAX) ) supersedes the
maximum operating ambient temperature (T A (MAX) ). See the Thermal
THERMAL RESISTANCE
Considerations section for more information.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Absolute maximum ratings apply individually only, not in
combination.
THERMAL CONSIDERATIONS
θ JA of the package is based on modeling and calculation using a
4-layer board. θ JA is highly dependent on the application and
board layout. In applications where high maximum power
dissipation exists, attention to thermal board design is required.
The value of θ JA may vary, depending on PCB material, layout,
and environmental conditions.
θ JA is specified for worst-case conditions, that is, a device soldered
on a circuit board for surface-mount packages. θ JA is determined
according to JEDEC Standard JESD51-9 on a 4-layer printed
circuit board (PCB).
Table 3 . Thermal Resistance (4-Layer PCB)
The maximum operating junction temperature (T J (MAX) )
supersedes the maximum operating ambient temperature
(T A (MAX) ) because the ADP2126 / ADP2127 may be damaged
Package Type
6-Ball Bumped Bare Die Sales
6-Pad Embedded Wafer Level Package
θ JA
105
105
Unit
°C/W
°C/W
when the junction temperature limits are exceeded. Monitoring
ambient temperature does not guarantee that T J is within the
specified temperature limits.
ESD CAUTION
In applications with high power dissipation and poor PCB
thermal resistance, the maximum ambient temperature may
need to be derated. In applications with moderate power
dissipation and good PCB thermal resistance, the maximum
Rev. B | Page 5 of 20
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