参数资料
| 型号： | ADP220ACBZ-2525R7 |
| 厂商： | Analog Devices Inc |
| 文件页数： | 14/20页 |
| 文件大小： | 0K |
| 描述： | IC REG LDO 2.5V .2A 6WLCSP |
| 产品变化通告： | 8mm Carrier Tape Changes 28/Feb/2012 |
| 标准包装： | 3,000 |
| 稳压器拓扑结构： | 正，固定式 |
| 输出电压： | 2.5V |
| 输入电压： | 2.5 V ~ 5.5 V |
| 稳压器数量： | 2 |
| 电流 - 输出： | 200mA（最小值） |
| 电流 - 限制（最小）： | 240mA |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 6-WFBGA，WLCSP |
| 供应商设备封装： | 6-WLCSP（1.45x0.95） |
| 包装： | 带卷 (TR) |
ADP220/ADP221
CURRENT-LIMIT AND THERMAL OVERLOAD
PROTECTION
The ADP220/ADP221 are protected against damage due to
excessive power dissipation by current and thermal overload
protection circuits. The ADP220/ADP221 are designed to
current limit when the output load reaches 300 mA (typical).
When the output load exceeds 300 mA, the output voltage is
reduced to maintain a constant current limit.
Thermal overload protection is built-in, which limits the
junction temperature to a maximum of 155°C (typical). Under
extreme conditions (that is, high ambient temperature and
power dissipation) when the junction temperature starts to
Data Sheet
To guarantee reliable operation, the junction temperature of
the ADP220/ADP221 must not exceed 125°C. To ensure that
the junction temperature stays below this maximum value, the
user needs to be aware of the parameters that contribute to junction
temperature changes. These parameters include ambient tem-
perature, power dissipation in the power device, and thermal
resistances between the junction and ambient air (θ JA ). The θ JA
number is dependent on the package assembly compounds used
and the amount of copper to which the GND pins of the package
are soldered on the PCB. Table 6 shows typical θ JA values for the
ADP220/ADP221 for various PCB copper sizes.
Table 6. Typical θ JA Values
rise above 155°C, the output is turned off, reducing the output
current to zero. When the junction temperature drops below
140°C, the output is turned on again and the output current
is restored to its nominal value.
Consider the case where a hard short from VOUTx to GND
occurs. At first, the ADP220/ADP221 current limit, so that only
Copper Size (mm 2 )
50
100
300
500
ADP220/ADP221 (°C/W)
200
119
118
115
113
Device soldered to minimum size pin traces.
300 mA is conducted into the short. If self-heating of the junction
is great enough to cause its temperature to rise above 155°C,
thermal shutdown activates, turning off the output and reducing
the output current to zero. As the junction temperature cools
1
The junction temperature of the ADP220/ADP221 can be
calculated from the following equation:
and drops below 140°C, the output turns on and conducts 300 mA
into the short, again causing the junction temperature to rise
above 155°C. This thermal oscillation between 140°C and
155°C causes a current oscillation between 0 mA and 300 mA
that continues as long as the short remains at the output.
Current and thermal limit protections are intended to protect
the device against accidental overload conditions. For reliable
operation, device power dissipation must be externally limited
so that junction temperatures do not exceed 125°C.
THERMAL CONSIDERATIONS
In most applications, the ADP220/ADP221 do not dissipate
much heat due to high efficiency. However, in applications with
a high ambient temperature and high supply voltage to output
voltage differential, the heat dissipated in the package is large
T J = T A + ( P D × θ JA )
where:
T A is the ambient temperature.
P D is the power dissipation in the die, given by
P D = Σ[( V IN ? V OUT ) × I LOAD ] + Σ( V IN × I GND )
where:
I LOAD is the load current.
I GND is the ground current.
V IN and V OUT are input and output voltages, respectively.
Power dissipation due to ground current is quite small and
can be ignored. Therefore, the junction temperature equation
simplifies to
T J = T A + {Σ[( V IN ? V OUT ) × I LOAD ] × θ JA }
(2)
(3)
(4)
enough that it can cause the junction temperature of the die
to exceed the maximum junction temperature of 125°C.
When the junction temperature exceeds 155°C, the converter
enters thermal shutdown. It recovers only after the junction
temperature has decreased below 140°C to prevent any permanent
damage. Therefore, thermal analysis for the chosen application
is very important to guarantee reliable performance over all
conditions. The junction temperature of the die is the sum of
the ambient temperature of the environment and the tempera-
ture rise of the package due to the power dissipation, as shown
As shown in Equation 4, for a given ambient temperature,
input-to-output voltage differential, and continuous load
current, there exists a minimum copper size requirement
for the PCB to ensure the junction temperature does not rise
above 125°C. Figure 35 to Figure 39 show junction temperature
calculations for different ambient temperatures, total power
dissipation, and areas of PCB copper.
In cases where the board temperature is known, the thermal
characterization parameter, Ψ JB , can be used to estimate the
junction temperature rise. T J is calculated from T B and P D using
the formula
T J = T B + ( P D × Ψ JB )
The typical Ψ JB value for the 6-ball WLCSP is 43.8°C/W.
Rev. H | Page 14 of 20
(5)
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| ADP220ACBZ-26235R7 | 功能描述:IC REG LDO 2.6V/2.35V .2A 6WLCSP RoHS:是 类别:集成电路 (IC) >> PMIC - 稳压器 - 线性 系列:- 标准包装:75 系列:- 稳压器拓扑结构:正，可调式 输出电压:1.2 V ~ 37 V 输入电压:4.2 V ~ 40 V 电压 - 压降（标准）:- 稳压器数量:1 电流 - 输出:500mA 电流 - 限制（最小）:500mA 工作温度:-40°C ~ 125°C 安装类型:表面贴装 封装/外壳:TO-252-3，DPak（2 引线+接片），SC-63 供应商设备封装:TO-252-3 包装:管件 产品目录页面:1286 (CN2011-ZH PDF) 其它名称:*LM317AMDT/NOPBLM317AMDT |
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