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参数资料
| 型号： | ADP3050-BL1-EVZ |
| 厂商： | Analog Devices Inc |
| 文件页数： | 16/20页 |
| 文件大小： | 0K |
| 描述： | BOARD EVALUATION FOR ADP3050 |
| 标准包装： | 1 |
| 系列： | * |
ADP3050
Data Sheet
V IN ( MIN ) =
P SW = ? ? 0 . 8 × 0 . 6 ×
? +
V OUT + V SAT
0 . 85
THERMAL CONSIDERATIONS
(12)
3 . 3 ?
? 5 . 0 ?
( 50 × 10 ? 9 × 0 . 8 × 5 . 0 × 200 × 10 3 ) = 357 mW
P BOOST =
0 . 8 3 . 3 2
P Q = ( 5 × 10 ? 3 ) + ( 3 . 3 × 4 × 10 ? 3 ) = 18 mW
Several factors contribute to IC power dissipation: ac and dc
switch losses, boost current, and quiescent current. The following
formulas are used to calculate these losses to determine the power
dissipation of the IC. These formulas assume continuous mode
operation, but they provide a reasonable estimate for disconti-
nuous mode systems (do not use these formulas to calculate
efficiency at light loads).
Switch loss
× = 35 mW
50 5 . 0
For a total IC power dissipation of
P TOTAL = P SW + P BOOST + P Q = 410 mW (16)
The ADP3050 is offered in a thermally enhanced (not Pb-free)
8-lead SOIC package with a thermal resistance, θ JA , of 60.6°C/W,
P SW = ? ? I OUT × V SAT × OUT
? + ( t OV × I OUT × V IN × f SW )
?
? V
Boost current loss
? V IN
?
?
(13)
and in a standard Pb-free 8-lead SOIC package with θ JA of
87.5°C/W.
The maximum die temperature, T J , is calculated using the
thermal resistance and the maximum ambient temperature
I OUT
V
P BOOST = × OUT
2
β SW V IN
Quiescent current loss
P Q = ( V IN × I Q ) + ( V OUT × I BIAS )
where:
f SW is the switch frequency (200 kHz).
t OV is the switch current/voltage overlap time (~50 ns).
β SW is the current gain of the NPN power switch (~50).
I Q is the quiescent current drawn from V IN (~1 mA).
I BIAS is the quiescent current drawn from V OUT (~4 mA).
For example, a 5 V to 3.3 V system with I OUT = 800 mA
(14)
(15)
T J = T A + θ JA × P TOTAL (17)
For the previous example (5 V to 3.3 V at 800 mA system, Pb-
free 8-lead SOIC package using good layout techniques) with a
worst-case ambient temperature of 70°C
T J = 70° C + 87.5° C/W × 0.41 = 105.9° C
The maximum operating junction (die) temperature is 125°C,
therefore this system operates within the safe limits of the
ADP3050. Check the die temperature at minimum and
maximum supply voltages to ensure proper operation under all
conditions. Although the PCB and its copper traces provide
sufficient heat sinking, it is important to follow the layout
suggestions in the Board Layout Guidelines section. For any
design that combines high output current with high duty cycle
and/or high input voltage, the junction temperature must be
calculated to ensure normal operation. Always use the
equations in this section to estimate the power dissipation.
Rev. C | Page 16 of 20
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相关代理商/技术参数 |
参数描述 |
|---|---|
| ADP3050-EVAL | 功能描述:BOARD EVAL FOR ADP3050 RoHS:否 类别:编程器，开发系统 >> 评估板 - DC/DC 与 AC/DC（离线）SMPS 系列:- 标准包装:1 系列:- 主要目的:DC/DC，步降 输出及类型:1，非隔离 功率 - 输出:- 输出电压:3.3V 电流 - 输出:3A 输入电压:4.5 V ~ 28 V 稳压器拓扑结构:降压 频率 - 开关:250kHz 板类型:完全填充 已供物品:板 已用 IC / 零件:L7981 其它名称:497-12113STEVAL-ISA094V1-ND |
| ADP3050-EVALZ | 制造商:AD 制造商全称:Analog Devices 功能描述:200 kHz, 1 A High Voltage Step-Down Switching Regulator |
| ADP3051 | 制造商:AD 制造商全称:Analog Devices 功能描述:500 mA PWM Step-Down DC-DC with Synchronous Rectifier |
| ADP3051ARMZ-REEL | 制造商:Analog Devices 功能描述:CONV DC-DC SGL-OUT STEP DOWN 8MSOP - Tape and Reel |
| ADP3051ARMZ-REEL7 | 制造商:Analog Devices 功能描述:Conv DC-DC Single Step Down 2.7V to 5.5V 8-Pin MSOP T/R 制造商:Analog Devices 功能描述:SWITCH REG SYNC BUCK 500MA 8MSOP |
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