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| 型号： | ADP323ACPZ-R7 |
| 厂商： | Analog Devices Inc |
| 文件页数： | 20/24页 |
| 文件大小： | 0K |
| 描述： | IC REG LDO ADJ .2A 16LFCSP |
| 标准包装： | 1 |
| 稳压器拓扑结构： | 正，可调式 |
| 输出电压： | 1.8 V ~ 5.5 V |
| 输入电压： | 1.8 V ~ 5.5 V |
| 电压 - 压降（标准）： | 0.11V @ 200mA |
| 稳压器数量： | 3 |
| 电流 - 输出： | 200mA |
| 电流 - 限制（最小）： | 250mA |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 16-WFQFN 裸露焊盘，CSP |
| 供应商设备封装： | 16-LFCSP-WQ（3x3） |
| 包装： | 标准包装 |
| 其它名称： | ADP323ACPZ-R7DKR |
ADP322/ADP323
Data Sheet
PRINTED CIRCUIT BOARD LAYOUT
CONSIDERATIONS
Heat dissipation from the package can be improved by
increasing the amount of copper attached to the pins of the
ADP322/ADP323. However, as can be seen from Table 7, a
point of diminishing returns is eventually reached, beyond
which an increase in the copper size does not yield significant
heat dissipation benefits.
Place the input capacitor as close as possible to the VINx and
GND pins. Place the output capacitors as close as possible to
the VOUTx and GND pins. Use 0402 or 0603 size capacitors
and resistors to achieve the smallest possible footprint solution
on boards where area is limited.
Figure 55. Example of PCB Layout, Top Side
Figure 56. Example of PCB Layout, Bottom Side
Rev. A | Page 20 of 24
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