参数资料
型号: ADP3336ARM-REEL7
厂商: Analog Devices Inc
文件页数: 7/9页
文件大小: 0K
描述: IC REG LDO ADJ .5A 8-MSOP
设计资源: Analog Audio Input, Class-D Output with ADAU1701, SSM2306, and ADP3336 (CN0162)
标准包装: 1
系列: anyCAP®
稳压器拓扑结构: 正,可调式
输出电压: 1.5 V ~ 10 V
输入电压: 2.6 V ~ 12 V
电压 - 压降(标准): 0.2V @ 500mA
稳压器数量: 1
电流 - 输出: 500mA
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 8-TSSOP,8-MSOP(0.118",3.00mm 宽)
供应商设备封装: 8-MSOP
包装: 剪切带 (CT)
其它名称: ADP3336ARMREEL7CT
ADP3336
Output Voltage
The ADP3336 has an adjustable output voltage that can be set
by an external resistor divider. The output voltage will be
divided by R1 and R2, and then fed back to the FB pin.
In order to have the lowest possible sensitivity of the output
voltage to temperature variations, it is important that the paral-
lel resistance of R1 and R2 is always 50 k ? .
R 1 × R 2
R 1 + R 2
= 50 k ?
DIE
Also, for the best accuracy over temperature the feedback volt-
V FB = V OUT × ?
? R 1 + R 2 ?
age should be set for 1.178 V:
? R 2 ?
?
where V OUT is the desired output voltage and V FB is the “ virtual
bandgap ” voltage. Note that V FB does not actually appear at the
FB pin due to loading by the internal PTAT current.
Combining the above equations and solving for R1 and R2 gives
the following formulas:
Figure 4. Thermally Enhanced Paddle-Under-Lead Package
Thermal Overload Protection
The ADP3336 is protected against damage from excessive power
dissipation by its thermal overload protection circuit which limits
the die temperature to a maximum of 165 ° C. Under extreme
conditions (i.e., high ambient temperature and power dissipation)
where die temperature starts to rise above 165 ° C, the output
current is reduced until the die temperature has dropped to a
safe level. The output current is restored when the die tempera-
ture is reduced.
R 1 = 50 k ? ×
V OUT
V FB
Current and thermal limit protections are intended to protect
the device against accidental overload conditions. For normal
operation, device power dissipation should be externally limited
?
V OUT ?
R 2 =
50 k ?
? V FB ?
? 1 – ?
so that junction temperatures will not exceed 150 ° C.
Calculating Junction Temperature
Device power dissipation is calculated as follows:
P D = ( V IN – V OUT ) I LOAD + ( V IN ) I GND
Table I. Feedback Resistor Selection
Where I LOAD and I GND are load current and ground current, V IN
V OUT
1.5 V
1.8 V
2.2 V
2.7 V
3.3 V
5V
10 V
R1 (1% Resistor)
63.4 k ?
76.8 k ?
93.1 k ?
115 k ?
140 k ?
210 k ?
422 k ?
R2 (1% Resistor)
232 k ?
147 k ?
107 k ?
88.7 k ?
78.7 k ?
64.9 k ?
56.2 k ?
and V OUT are input and output voltages respectively.
Assuming I LOAD = 400 mA, I GND = 4 mA, V IN = 5.0 V and
V OUT = 3.3 V, device power dissipation is:
P D = (5 – 3.3) 400 mA + 5.0(4 mA ) = 700 mW
The proprietary package used in the ADP3336 has a thermal
resistance of 110 ° C/W, significantly lower than a standard
MSOP-8 package. Assuming a 4-layer board, the junction tem-
perature rise above ambient temperature will be approximately
equal to:
? T J A = 0 . 700 W × 110 ° C = 77 . 0 ° C
Paddle-Under-Lead Package
The ADP3336 uses a proprietary paddle-under-lead package
design to ensure the best thermal performance in an MSOP-8
footprint. This new package uses an electrically isolated die
attach that allows all pins to contribute to heat conduction.
This technique reduces the thermal resistance to 110 ° C/W on a
4-layer board as compared to >160 ° C/W for a standard MSOP-8
leadframe. Figure 4 shows the standard physical construction
of the MSOP-8 and the paddle-under-lead leadframe.
REV. A
To limit the maximum junction temperature to 150 ° C, maxi-
mum allowable ambient temperature will be:
T AMAX = 150 ° C – 77.0 ° C = 73.0 ° C
Printed Circuit Board Layout Consideration
All surface mount packages rely on the traces of the PC board to
conduct heat away from the package.
–7 –
相关PDF资料
PDF描述
HSM36DSES-S243 CONN EDGECARD 72POS .156 EYELET
HMM36DSES-S243 CONN EDGECARD 72POS .156 EYELET
RW2-2415S CONV DC/DC 2W 18-36VIN 15VOUT
ADP3330ART-3.3-RL7 IC REG LDO 3.3V .2A SOT-23-6
1N5404G-T RECTIFIER GPP 400V 3A DO-201AD
相关代理商/技术参数
参数描述
ADP3336ARMZ 制造商:Analog Devices 功能描述:LDO 2.6-12V 0.5A 1.5-10V 8 制造商:Analog Devices 功能描述:LDO, 2.6-12V, 0.5A, 1.5-10V, 8MSOP; Primary Input Voltage:12V; Dropout Voltage Vdo:200mV; Voltage Regulator Case Style:MSOP; No. of Pins:8; Output Current:500mA; Operating Temperature Min:-40C; Operating Temperature Max:85C; MSL:-;;RoHS Compliant: Yes
ADP3336ARMZ-REEL 制造商:Analog Devices 功能描述:LDO Regulator Pos 1.5V to 10V 0.8A 8-Pin MSOP T/R 制造商:Analog Devices 功能描述:LDO ADJ 0.5A SMD MSOP8 3336
ADP3336ARMZ-REEL7 功能描述:IC REG LDO ADJ .5A 8-MSOP RoHS:是 类别:集成电路 (IC) >> PMIC - 稳压器 - 线性 系列:anyCAP® 标准包装:75 系列:- 稳压器拓扑结构:正,可调式 输出电压:1.2 V ~ 37 V 输入电压:4.2 V ~ 40 V 电压 - 压降(标准):- 稳压器数量:1 电流 - 输出:500mA 电流 - 限制(最小):500mA 工作温度:-40°C ~ 125°C 安装类型:表面贴装 封装/外壳:TO-252-3,DPak(2 引线+接片),SC-63 供应商设备封装:TO-252-3 包装:管件 产品目录页面:1286 (CN2011-ZH PDF) 其它名称:*LM317AMDT/NOPBLM317AMDT
ADP3336ARMZ-REEL7 制造商:Analog Devices 功能描述:IC, ADJ LDO REG, 1.5V TO 10V 0.5A 8-SOIC
ADP3338 制造商:AD 制造商全称:Analog Devices 功能描述:High-Accuracy Ultralow IQ, 1 A, anyCAP Low Dropout Regulator