参数资料
型号: ADP5024ACPZ-1-R7
厂商: ANALOG DEVICES INC
元件分类: 稳压器
英文描述: SWITCHING REGULATOR, PQCC24
封装: 4 X 4 MM, ROHS COMPLIANT, MO-220, LCC-24
文件页数: 8/27页
文件大小: 926K
代理商: ADP5024ACPZ-1-R7
ADP5024
Preliminary Technical Data
Rev. PrA | Page 16 of 27
Switching losses are associated with the current drawn by the
driver to turn on and turn off the power devices at the switching
frequency. The amount of switching power loss is given by
PSW
= (CGATE-P + CGATE-N) × VIN12 × fSW
(10)
where:
CGATE-P
is the P-MOSFET gate capacitance.
CGATE-N
is the N-MOSFET gate capacitance.
For the ADP5024, the total of (CGATE-P + CGATE-N) is
approximately 150 pF.
The transition losses occur because the P-channel power
MOSFET cannot be turned on or off instantaneously, and the
SW node takes some time to slew from near ground to near
VOUT1 (and from VOUT1 to ground). The amount of transition
loss is calculated by
PTRAN
= VIN1 × IOUT1 × (tRISE + tFALL) × fSW
(11)
where tRISE and tFALL are the rise time and the fall time of the
switching node, SW. For the ADP5024, the rise and fall times
of SW are in the order of 5 ns.
If the preceding equations and parameters are used for
estimating the converter efficiency, it must be noted that the
equations do not describe all of the converter losses, and the
parameter values given are typical numbers. The converter
performance also depends on the choice of passive
components and board layout; therefore, a sufficient safety
margin should be included in the estimate.
LDO Regulator Power Dissipation
The power loss of a LDO regulator is given by
PDLDO
= [(VIN VOUT) × ILOAD] + (VIN × IGND)
(12)
where:
ILOAD
is the load current of the LDO regulator.
VIN
and VOUT are input and output voltages of the LDO,
respectively.
IGND
is the ground current of the LDO regulator.
Power dissipation due to the ground current is small and it
can be ignored.
JUNCTION TEMPERATURE
The total power dissipation in the ADP5024 simplifies to
PD
= PDBUCK + PDLDO1
(13)
In cases where the board temperature TA is known, the
thermal resistance parameter, θJA, can be used to estimate the
junction temperature rise. TJ is calculated from TA and PD
using the formula
TJ
= TA + (PD × θJA)
(14)
The typical θJA value for the 24-lead, 4 mm × 4 mm LFCSP is
35°C/W (see Table 6). A very important factor to consider is
that θJA is based on a 4-layer 4 in × 3 in, 2.5 oz copper, as per
JEDEC standard, and real applications may use different sizes
and layers. It is important to maximize the copper used to
remove the heat from the device. Copper exposed to air
dissipates heat better than copper used in the inner layers.
The exposed pad should be connected to the ground plane
with several vias.
If the case temperature can be measured, the junction
temperature is calculated by
TJ
= TC + (PD × θJC)
(15)
where TC is the case temperature and θJC is the junction-to-
case thermal resistance provided in Table 6.
When designing an application for a particular ambient
temperature range, calculate the expected ADP5024 power
dissipation (PD) due to the losses of all channels by using the
Equation 8 to Equation 13. From this power calculation, the
junction temperature, TJ, can be estimated using Equation 14.
The reliable operation of the converter and the two LDO
regulators can be achieved only if the estimated die junction
temperature of the ADP5024 (Equation 14) is less than
125°C. Reliability and mean time between failures (MTBF) is
highly affected by increasing the junction temperature.
Additional information about product reliability can be found
from the ADI Reliability Handbook, which can be found at
www.analog.com/reliability_handbook.
相关PDF资料
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