参数资料
型号: ADP5042ACPZ-1-R7
厂商: Analog Devices Inc
文件页数: 2/32页
文件大小: 1378K
描述: IC REG TRPL BCK/LINEAR 20LFCSP
标准包装: 1
拓扑: 降压(降压)同步(1),线性(LDO)(2)
功能: 任何功能
输出数: 3
频率 - 开关: 3MHz
电压/电流 - 输出 1: 1.8V,800mA
电压/电流 - 输出 2: 1.5V,300mA
电压/电流 - 输出 3: 3.3V,300mA
带 LED 驱动器:
带监控器:
带序列发生器:
电源电压: 1.7 V ~ 5.5 V
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 20-WFQFN 裸露焊盘,CSP
供应商设备封装: 20-LFCSP-WQ(4x4)
包装: 标准包装
其它名称: ADP5042ACPZ-1-R7DKR
ADP5042
Data Sheet
 
Rev. A | Page 2 of 32
TABLE OF CONTENTS
Features .............................................................................................. 1?/SPAN>
High Level Block Diagram .............................................................. 1?/SPAN>
General Description ......................................................................... 1?/SPAN>
Revision History ............................................................................... 2?/SPAN>
Specifications ..................................................................................... 3?/SPAN>
General Specification ................................................................... 3?/SPAN>
Supervisory Specification ............................................................ 3?/SPAN>
Buck Specifications ....................................................................... 5?/SPAN>
LDO1, LDO2 Specifications ....................................................... 5?/SPAN>
Input and Output Capacitor, Recommended Specifications .. 6?/SPAN>
Absolute Maximum Ratings ............................................................ 7?/SPAN>
Thermal Data ................................................................................ 7?/SPAN>
Thermal Resistance ...................................................................... 7?/SPAN>
ESD Caution .................................................................................. 7?/SPAN>
Pin Configuration and Function Descriptions ............................. 8?/SPAN>
Theory of Operation ...................................................................... 18?/SPAN>
Power Management Unit ........................................................... 18?/SPAN>
Buck Section ................................................................................ 19?/SPAN>
LDO Section ............................................................................... 20?/SPAN>
Supervisory Section ................................................................... 20?/SPAN>
Applications Information .............................................................. 23?/SPAN>
Buck External Component Selection ....................................... 23?/SPAN>
LDO Capacitor Selection .......................................................... 24?/SPAN>
Supervisory Section ................................................................... 25?/SPAN>
PCB Layout Guidelines .............................................................. 26?/SPAN>
Evaluation Board Schematics and Artwork ............................ 27?/SPAN>
Suggested Layout ........................................................................ 27?/SPAN>
Bill of Materials ........................................................................... 28?/SPAN>
Application Diagram ................................................................. 28?/SPAN>
Factory Programmable Options ................................................... 29?/SPAN>
Outline Dimensions ....................................................................... 30?/SPAN>
Ordering Guide .......................................................................... 30?/SPAN>
 
REVISION HISTORY
10/11Rev. 0 to Rev. A
Updated Outline Dimensions ....................................................... 30
Changes to Ordering Guide .......................................................... 30
12/10Revision 0: Initial Version 
 
 
 
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