参数资料
型号: ADR127AUJZ-REEL7
厂商: Analog Devices Inc
文件页数: 16/20页
文件大小: 0K
描述: IC VREF SERIES PREC 1.25V TSOT-6
设计资源: Generating a Negative Precision Voltage Reference Without Precision Resistors (CN0005)
Single Supply Low Noise LED Current Source Driver Using a Current Output DAC in the Reverse Mode (CN0139)
标准包装: 1
基准类型: 串联,精度
输出电压: 1.25V
容差: ±0.24%
温度系数: 25ppm/°C
输入电压: 2.7 V ~ 18 V
通道数: 1
电流 - 静态: 95µA
电流 - 输出: 5mA
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: SOT-23-6 细型,TSOT-23-6
供应商设备封装: TSOT-6
包装: 标准包装
产品目录页面: 795 (CN2011-ZH PDF)
其它名称: ADR127AUJZ-REEL7DKR

ADR121/ADR125/ADR127
THEORY OF OPERATION
The ADR12x band gap references are the high performance
solution for low supply voltage and low power applications.
The uniqueness of these products lies in their architecture.
POWER DISSIPATION CONSIDERATIONS
The ADR12x family is capable of delivering load currents up to
5 mA with an input range from 3.0 V to 18 V. When this device
is used in applications with large input voltages, care must be
taken to avoid exceeding the specified maximum power
dissipation or junction temperature because this could result
in premature device failure.
Use the following formula to calculate a device’s maximum
junction temperature or dissipation:
INPUT CAPACITOR
Input capacitors are not required on the ADR12x. There is no
limit for the value of the capacitor used on the input, but a 1 μF
to 10 μF capacitor on the input may improve transient response
in applications where there is a sudden supply change. An
additional 0.1 μF capacitor in parallel also helps reduce noise
from the supply.
OUTPUT CAPACITOR
The ADR12x requires a small 0.1 μF capacitor for stability.
Additional 0.1 μF to 10 μF capacitance in parallel can improve
load transient response. This acts as a source of stored energy
for a sudden increase in load current. The only parameter
affected with the additional capacitance is turn-on time.
P D =
T J ? T A
θ JA
(4)
where:
T J is the junction temperature.
T A is the ambient temperature.
P D is the device power dissipation.
θ JA is the device package thermal resistance.
Rev. B | Page 16 of 20
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