参数资料
型号: ADSP-BF524BBCZ-4A
厂商: Analog Devices Inc
文件页数: 87/88页
文件大小: 0K
描述: IC DSP CTRLR 400MHZ 208CSPBGA
标准包装: 1
系列: Blackfin®
类型: 定点
接口: DMA,I²C,PPI,SPI,SPORT,UART,USB
时钟速率: 400MHz
非易失内存: ROM(32 kB)
芯片上RAM: 132kB
电压 - 输入/输出: 1.8V,2.5V,3.3V
电压 - 核心: 1.30V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 208-LFBGA,CSPBGA
供应商设备封装: 208-CSPBGA
包装: 托盘
ADSP-BF522/ADSP-BF523/ADSP-BF524/ADSP-BF525/ADSP-BF526/ADSP-BF527
SURFACE-MOUNT DESIGN
Table 71 is provided as an aid to PCB design. For industry-stan-
dard design recommendations, refer to IPC-7351, Generic
Requirements for Surface Mount Design and Land Pattern
Standard .
Table 71. Surface-Mount Design Supplement
Package Solder Mask
Package
289-Ball CSP_BGA
208-Ball CSP_BGA
Package Ball Attach Type
Solder Mask Defined
Solder Mask Defined
Opening
0.26 mm diameter
0.40 mm diameter
Package Ball Pad Size
0.35 mm diameter
0.50 mm diameter
AUTOMOTIVE PRODUCTS
The ADBF525W model is available with controlled manufactur-
ing to support the quality and reliability requirements of
automotive applications. Note that these automotive models
may have specifications that differ from the commercial models
and designers should review the product Specifications section
Table 72. Automotive Products
of this data sheet carefully. Only the automotive grade products
shown in Table 72 are available for use in automotive applica-
tions. Contact your local ADI account representative for specific
product ordering information and to obtain the specific auto-
motive Reliability reports for these models.
Temperature
Package
Instruction
Automotive Models 1, 2
ADBF525WBBCZ4xx
ADBF525WBBCZ5xx
ADBF525WYBCZxxx
Range 3
–40°C to +85°C
–40°C to +85°C
–40°C to +105°C
Package Description
208-Ball CSP_BGA
208-Ball CSP_BGA
208-Ball CSP_BGA
Option
BC-208-2
BC-208-2
BC-208-2
Rate (Max)
400 MHz
533 MHz
For product details, please contact your
ADI account representative.
1
2
3
Z = RoHS Compliant Part.
The information indicated by x in the model number will be provided by your ADI account representative.
Referenced temperature is ambient temperature. The ambient temperature is not a specification. Please see Operating Conditions for ADSP-BF523/ADSP-BF525/
ADSP-BF527 Processors on Page 30 for junction temperature (T J ) specification which is the only temperature specification.
Rev. D |
Page 87 of 88 | July 2013
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ADSP-BF524KBCZ-3 功能描述:IC DSP CTRLR 300MHZ 289CSPBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - DSP(数字式信号处理器) 系列:Blackfin® 标准包装:2 系列:StarCore 类型:SC140 内核 接口:DSI,以太网,RS-232 时钟速率:400MHz 非易失内存:外部 芯片上RAM:1.436MB 电压 - 输入/输出:3.30V 电压 - 核心:1.20V 工作温度:-40°C ~ 105°C 安装类型:表面贴装 封装/外壳:431-BFBGA,FCBGA 供应商设备封装:431-FCPBGA(20x20) 包装:托盘
ADSP-BF524KBCZ-3C2 功能描述:IC DSP CTRLR 300MHZ 289CSPBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - DSP(数字式信号处理器) 系列:Blackfin® 标准包装:2 系列:StarCore 类型:SC140 内核 接口:DSI,以太网,RS-232 时钟速率:400MHz 非易失内存:外部 芯片上RAM:1.436MB 电压 - 输入/输出:3.30V 电压 - 核心:1.20V 工作温度:-40°C ~ 105°C 安装类型:表面贴装 封装/外壳:431-BFBGA,FCBGA 供应商设备封装:431-FCPBGA(20x20) 包装:托盘
ADSP-BF524KBCZ-4 功能描述:IC DSP CTRLR 400MHZ 289CSPBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - DSP(数字式信号处理器) 系列:Blackfin® 标准包装:2 系列:StarCore 类型:SC140 内核 接口:DSI,以太网,RS-232 时钟速率:400MHz 非易失内存:外部 芯片上RAM:1.436MB 电压 - 输入/输出:3.30V 电压 - 核心:1.20V 工作温度:-40°C ~ 105°C 安装类型:表面贴装 封装/外壳:431-BFBGA,FCBGA 供应商设备封装:431-FCPBGA(20x20) 包装:托盘
ADSP-BF524KBCZ-4AX 制造商:Analog Devices 功能描述:
ADSP-BF524KBCZ-4C2 功能描述:IC DSP CTRLR 400MHZ 289CSPBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - DSP(数字式信号处理器) 系列:Blackfin® 标准包装:2 系列:StarCore 类型:SC140 内核 接口:DSI,以太网,RS-232 时钟速率:400MHz 非易失内存:外部 芯片上RAM:1.436MB 电压 - 输入/输出:3.30V 电压 - 核心:1.20V 工作温度:-40°C ~ 105°C 安装类型:表面贴装 封装/外壳:431-BFBGA,FCBGA 供应商设备封装:431-FCPBGA(20x20) 包装:托盘