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参数资料
型号： ADSP-BF542MBBCZ-5M
厂商： ANALOG DEVICES INC
元件分类： 数字信号处理
英文描述： 533 MHz Blackfin Embedded Processor: ADSP-BF542MBBCZ-5M Temp Range: –40°C to +85°C Package: 400-Ball CSP_BGA BC-400-1
中文描述： 16-BIT, 50 MHz, OTHER DSP, PBGA400
封装： 17 X 17 MM, ROHS COMPLIANT, CSBGA-400
文件页数： 13/100页
文件大小： 3095K
代理商： ADSP-BF542MBBCZ-5M
Rev. D
|
Page 2 of 100
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May 2011
ADSP-BF542/ADSP-BF544/ADSP-BF547/ADSP-BF548/ADSP-BF549
TABLE OF CONTENTS
General Description ................................................. 3
Low Power Architecture ......................................... 4
System Integration ................................................ 4
Blackfin Processor Peripherals ................................. 4
Blackfin Processor Core .......................................... 4
Memory Architecture ............................................ 6
DMA Controllers .................................................. 9
Real-Time Clock ................................................. 10
Watchdog Timer ................................................ 10
Timers ............................................................. 10
Up/Down Counter and Thumbwheel Interface .......... 11
Serial Ports (SPORTs) .......................................... 11
Serial Peripheral Interface (SPI) Ports ...................... 11
UART Ports (UARTs) .......................................... 11
Controller Area Network (CAN) ............................ 12
TWI Controller Interface ...................................... 12
Ports ................................................................ 12
Pixel Compositor (PIXC) ...................................... 13
Enhanced Parallel Peripheral Interface (EPPI) ........... 13
USB On-the-Go Dual-Role Device Controller ............ 13
ATA/ATAPI-6 Interface ....................................... 14
Keypad Interface ................................................. 14
Secure Digital (SD)/SDIO Controller ....................... 14
Code Security ..................................................... 14
Media Transceiver MAC Layer (MXVR) ................... 14
Dynamic Power Management ................................ 15
Voltage Regulation .............................................. 16
Clock Signals ...................................................... 17
Booting Modes ................................................... 18
Instruction Set Description .................................... 21
Development Tools .............................................. 21
Designing an Emulator-Compatible Processor Board ... 21
MXVR Board Layout Guidelines ............................. 21
Related Documents .............................................. 22
Related Signal Chains ........................................... 22
Lockbox Secure Technology Disclaimer .................... 22
Pin Descriptions .................................................... 23
Specifications ........................................................ 33
400-Ball CSP_BGA Package ...................................... 92
Outline Dimensions ................................................ 98
Surface-Mount Design .......................................... 98
Automotive Products .............................................. 99
Ordering Guide ..................................................... 99
REVISION HISTORY
5/11—Rev. C to Rev. D
Numerous small corrections and additions to document.
Major changes/additions include:
Added several extended temperature models. For more infor-
mation, see Ordering Guide ...................................... 99
Added new text for pin descriptions in Pin Descriptions .. 23
Added 400 MHz Junction Temperature to Parameter column of
the Operating Conditions table in Specifications ............ 33
Updated Table 15 to include information on extended tempera-
ture grade parts. See System Clock Requirements ........... 34
Data in the Nonautomotive 400 MHz column of Electrical
Characteristics also applies to extended temperature grade as
noted in footnote 1. See Electrical Characteristics .......... 35
Updated Table 23 to reflect RoHS compliant part is optional.
See Package Information ......................................... 40
Updated Table 31 to reflect extended temperature grade part.
See DDR SDRAM/Mobile DDR SDRAM Clock and Control
Cycle Timing ........................................................ 47
Added timer clock timing specification table (Table 47) and fig-
ure (Figure 41). See Timer Clock Timing ...................... 66
Updated package diagram to correct JEDEC specification and
outdated coplanarity number. See Outline Dimensions .... 98
To view product/process change notifications (PCNs) related to
this data sheet revision, please visit the processor's product page
on the www.analog.com website and use the View PCN link.
相关PDF资料
PDF描述
ADSP-BF542KBCZ-6A 600 MHz Blackfin Embedded Processor: ADSP-BF542KBCZ-6A Temp Range: 0°C to +70°C Package: 400-Ball CSP_BGA BC-400-1
ADSP-BF544BBCZ-4A 400 MHz Blackfin Embedded Processor: ADSP-BF544BBCZ-4A Temp Range: –40°C to +85°C Package: 400-Ball CSP_BGA BC-400-1
ADSP-BF544BBCZ-5A 533 MHz Blackfin Embedded Processor: ADSP-BF544BBCZ-5A Temp Range: –40°C to +85°C Package: 400-Ball CSP_BGA BC-400-1
ADSP-BF544MBBCZ-5M 533 MHz Blackfin Embedded Processor: ADSP-BF544MBBCZ-5M Temp Range: –40°C to +85°C Package: 400-Ball CSP_BGA BC-400-1
ADSP-BF547BBCZ-5A 533 MHz Blackfin Embedded Processor: ADSP-BF547BBCZ-5A Temp Range: –40°C to +85°C Package: 400-Ball CSP_BGA BC-400-1
相关代理商/技术参数
参数描述
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