参数资料
型号: ADSP-TS203SABP-050
厂商: ANALOG DEVICES INC
元件分类: 数字信号处理
英文描述: 500 MHz TigerSHARC Processor with 4 Mbit on-chip embedded DRAM; Package: 576 ball SBGA; No of Pins: 576; Temperature Range: Ind
中文描述: 32-BIT, 125 MHz, OTHER DSP, PBGA576
封装: 25 X 25 MM, MS-034, BGA-576
文件页数: 39/48页
文件大小: 2017K
代理商: ADSP-TS203SABP-050
Rev. C
|
Page 44 of 48
|
December 2006
ADSP-TS203S
OUTLINE DIMENSIONS
The ADSP-TS203S processor is available in a 25 mm
× 25 mm,
576-ball metric thermally enhanced ball grid array (BGA_ED)
package with 24 rows of balls (BP-576).
SURFACE MOUNT DESIGN
The following table is provided as an aide to PCB design. The
numbers listed in the table are for reference purposes and
should not supersede the PCB design rules. Please reference
IPC-7351, Surface Mount Design and Land Pattern Standard,
for PCB design recommendations.
Figure 47. 576-Ball BGA_ED (BP-576)
1.00
BSC
(BALL
PITCH)
0.75
0.65
0.55
(BALL
DIAMETER)
DETAIL A
NOTES:
1. ALL DIMENSIO NS ARE IN MILL IMET ERS.
2. THE ACTUAL PO SITION OF THE BAL L GR ID IS W ITHIN 0.25 m m OF ITS
IDEAL POSITIO N RELATIVE TO THE PACKAGE EDGES.
3. CENTER DIMENSIONS ARE N OMINAL.
4. THIS PACKAG E C ONFO RMS TO JEDEC MS-034 SPECIF ICATIO N.
SEATING PLANE
1.60 MAX
0.20 MAX
DETAIL A
0.97 BSC
7
95
3
1
11
13
15
17
21 19
23
6
8
10
12
14
16
18
20
24 22
42
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
Y
W
V
U
T
AD
AC
AB
AA
23.00
BSC
SQ
25.20
25.00
24.80
25.20
25.00
24.80
TOP VIEW
BOTTOM VIEW
1.00
BSC
0.60
0.50
0.40
1.00
BSC
A1 BALL
INDICATOR
1.25
1.00
0.75
1.25
1.00
0.75
3.10
2.94
2.78
Package
Ball Attach Type
Solder Mask
Opening
Ball Pad Size
576-Ball BGA_ED
(BP-576-1)
Nonsolder Mask
Defined (NSMD)
0.69
0.56
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