参数资料
型号: ADT6503SRJZN025RL7
厂商: Analog Devices Inc
文件页数: 4/16页
文件大小: 268K
描述: IC TEMP SENSOR MICROPWR SOT23-5
产品培训模块: Temperature Sensors
标准包装: 1
功能: 温度开关
传感器类型: 内部
感应温度: -25°C 跳闸点
精确度: ±6°C(最小值)
拓扑: ADC(三角积分型),比较器,寄存器库
输出类型: 开路漏极
输出警报:
输出风扇:
电源电压: 2.7 V ~ 5.5 V
工作温度: -55°C ~ 125°C
安装类型: 表面贴装
封装/外壳: SC-74A,SOT-753
供应商设备封装: SOT-23-5
包装: 标准包装
产品目录页面: 798 (CN2011-ZH PDF)
其它名称: ADT6503SRJZN025RL7DKR
ADT6501/ADT6502/ADT6503/ADT6504
Data Sheet
 
Rev. B | Page 4 of 16
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
Rating
V to GND
0.3 V to +7 V
HYST In  ut Volta  e to GND
0.3 V to V   + 0.3 V
Open-Drain Output Voltage to GND
0.3 V to +7 V
Push-Pull Output Voltage to GND
0.3 V to V   + 0.3 V
Input Current on All Pins
20 mA
Output Current on All Pins
20 mA
O  eratin   Tem  erature Ran  e
55癈 to +125癈
Storage Temperature Range
65癈 to +160癈
Maximum Junction Temperature, T         150.7癈
5-Lead SOT-23 (RJ-5)
 
Power Dissipation
1
 
W
MAX
 = (T
MAX
  T
A
2
)/?/DIV>
A
 
Thermal Impedance
3
 
 
?nbsp  Junction-to-Ambient Still Air     240癈/W
IR Reflow Soldering
(RoHS Compliant Package)
 
Peak Temperature
260癈 (+0癈)
Time at Peak Temperature
20 sec to 40 sec
Ramp-Up Rate
3癈/sec maximum
Ram  -Down Rate
6癈/sec maximum
Time 25癈 to Peak Temperature
8 minute maximum
 
1
 Values relate to package being used on a standard 2-layer PCB. This gives a
worst case ?/DIV>
JA
. Refer to Figure 2 for a plot of maximum power dissipation vs.
ambient temperature (T
A
).
2
 T
A
 = ambient temperature.
3
 Junction-to-case resistance is applicable to components featuring a
preferential flow direction, for example, components mounted on a
heat sink. Junction-to-ambient resistance is more useful for air-cooled,
PCB-mounted components.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
 
Figure 2. SOT-23 Maximum Power Dissipation vs. Temperature
 
ESD CAUTION
 
 
 
 
 
0.9
0
125
TEMPERATURE  癈
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
55
50
40
30
20
10
0
10
20
30
40
50
60
70
80
90
100
110
120
SOT-23 PD @ 125癈 = 0.107W
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