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| 型号： | ADT7302ARMZ-REEL7 |
| 厂商： | Analog Devices Inc |
| 文件页数： | 5/16页 |
| 文件大小： | 238K |
| 描述： | IC SENSOR TEMP 13BIT DGTL 8MSOP |
| 产品变化通告： | ADT7301,02 Mask Revision 05/Sept/2011 |
| 标准包装： | 1,000 |
| 功能： | 温度监控系统（传感器） |
| 传感器类型： | 内部 |
| 感应温度： | -40°C ~ 125°C |
| 精确度： | ±2°C（最小值） |
| 拓扑： | ADC，寄存器库 |
| 输出类型： | MICROWIRE?，QSPI?，SPI? |
| 输出警报： | 无 |
| 输出风扇： | 无 |
| 电源电压： | 2.7 V ~ 5.25 V |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-TSSOP，8-MSOP（0.118"，3.00mm 宽） |
| 供应商设备封装： | 8-MSOP |
| 包装： | 带卷 (TR) |
ADT7302
Rev. B | Page 5 of 16
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
Rating
V
DD
to GND
0.3 V to +7 V
Digital Input Voltage to GND
0.3 V to V
DD
+ 0.3 V
Digital Output Voltage to GND
0.3 V to V
DD
+ 0.3 V
Operating Temperature Range
40癈 to +125癈
Storage Temperature Range
65癈 to +150癈
Junction Temperature
150癈
6-Lead SOT-23 (RJ-6)
Power Dissipation
1
W
MAX
= (T
J
max T
A
2
Thermal Impedance
)/?/DIV>
JA
?/DIV>
JA
, Junction-to-Ambient (Still Air) 190.4癈/W
8-Lead MSOP (RM-8)
Power Dissipation
1
W
MAX
= (T
J
max T
A
2
)/?/DIV>
JA
Thermal Impedance
3
?/DIV>
JA
, Junction-to-Ambient (Still Air) 205.9癈/W
?/DIV>
JC
, Junction-to-Case
43.74癈/W
IR Reflow Soldering
Peak Temperature
220癈 (0癈/5癈)
Time at Peak Temperature
10 sec to 20 sec
Ramp-Up Rate
3癈/sec max
Ramp-Down Rate
6癈/sec
Time 25癈 to Peak Temperature
6 minutes max
IR Reflow SolderingPb-Free Package
Peak Temperature
260癈 (0癈)
Time at Peak Temperature
20 sec to 40 sec
Ramp-Up Rate
3癈/sec max
Ramp-Down Rate
6癈/sec max
Time 25癈 to Peak Temperature
8 minutes max
1
Values relate to the package being used on a standard 2-layer PCB. Refer
to Figure 3 for a plot of maximum power dissipation vs. ambient
temperature (T
A
).
2
T
A
= ambient temperature.
3
Junction-to-case resistance is applicable to components featuring a
preferential flow direction, for example, components mounted on a heat
sink. Junction-to-ambient resistance is more useful for air-cooled, PCB-
mounted components.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
TEMPERATURE ?/SPAN>C
0
1.2
1.0
0.8
0.6
0.4
0.2
0
SOT-23
MSOP
Figure 3. Maximum Power Dissipation vs. Temperature
ESD CAUTION
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| ADT7302ARTZ-500RL7 | 功能描述:IC SENSOR TEMP 13BIT DGT SOT23-6 RoHS:是 类别:集成电路 (IC) >> PMIC - 热管理 系列:- 标准包装:2,500 系列:SilentSense™ 功能:温度监控系统（传感器） 传感器类型:内部和外部 感应温度:-55°C ~ 125°C，外部传感器 精确度:±2°C 本地（最大），±3°C 远程（最大） 拓扑:ADC（三角积分型），比较器，寄存器库 输出类型:I²C?/SMBus? 输出警报:是 输出风扇:是 电源电压:2.7 V ~ 5.5 V 工作温度:-55°C ~ 125°C 安装类型:表面贴装 封装/外壳:8-TSSOP，8-MSOP（0.118"，3.00mm 宽） 供应商设备封装:8-MSOP 包装:带卷 (TR) 其它名称:MIC284-2BMMTRMIC284-2BMMTR-ND |
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