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| 型号： | ADT7310TRZ-REEL7 |
| 厂商： | Analog Devices Inc |
| 文件页数： | 23/24页 |
| 文件大小： | 393K |
| 描述： | IC TEMP SENS 16B DGTL SPI 8SOIC |
| 标准包装： | 1,000 |
| 功能： | 温度监控系统（传感器） |
| 传感器类型： | 内部 |
| 感应温度： | -55°C ~ 150°C |
| 精确度： | ±0.5°C |
| 拓扑： | ADC（三角积分型），振荡器，寄存器库 |
| 输出类型： | SPI? |
| 输出警报： | 是 |
| 输出风扇： | 无 |
| 电源电压： | 2.7 V ~ 5.5 V |
| 工作温度： | -55°C ~ 150°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-SOIC（0.154"，3.90mm 宽） |
| 供应商设备封装： | 8-SO |
| 包装： | 带卷 (TR) |
Data Sheet
ADT7310
Rev. A | Page 23 of 24
APPLICATIONS INFORMATION
THERMAL RESPONSE TIME
The time required for a temperature sensor to settle to a
specified accuracy is a function of the thermal mass of the
sensor and the thermal conductivity between the sensor and
the object being sensed. Thermal mass is often considered
equivalent to capacitance. Thermal conductivity is commonly
specified using the symbol, Q, and can be thought of as thermal
resistance. It is commonly specified in units of degrees per watt
of power transferred across the thermal joint. The time required
for the part to settle to the desired accuracy is dependent on the
thermal contact established in that particular application, and
the equivalent power of the heat source. In most applications,
the settling time is best determined empirically.
SUPPLY DECOUPLING
The ADT7310 should be decoupled with a 0.1 礔 ceramic
capacitor between VDD and GND. This is particularly important
when the ADT7310 is mounted remotely from the power supply.
Precision analog products, such as the ADT7310, require a well-
filtered power source.
Because the ADT7310 operates from a single supply, it may
seem convenient to tap into the digital logic power supply.
Unfortunately, the logic supply is often a switch-mode design,
which generates noise in the 20 kHz to 1 MHz range. In addi-
tion, fast logic gates can generate glitches hundreds of millivolts
in amplitude due to wiring resistance and inductance.
If possible, the ADT7310 should be powered directly from the
system power supply. This arrangement, shown in Figure 24,
isolates the analog section from the logic-switching transients.
Even if a separate power supply trace is not available, generous
supply bypassing reduces supply-line induced errors. Local
supply bypassing consisting of a 0.1 礔 ceramic capacitor is
critical for the temperature accuracy specifications to be
achieved. This decoupling capacitor must be placed as close
as possible to the V
DD
pin of the ADT7310.
0.1礔
ADT7310
TTL/CMOS
LOGIC
CIRCUITS
POWER
SUPPLY
Figure 24. Use of Separate Traces to Reduce Power Supply Noise
TEMPERATURE MONITORING
The ADT7310 is ideal for monitoring the thermal environment
within hazardous automotive applications. The die accurately
reflects the exact thermal conditions that affect nearby
integrated circuits.
The ADT7310 measures and converts the temperature at the
surface of its own semiconductor chip. When the ADT7310 is
used to measure the temperature of a nearby heat source, the
thermal impedance between the heat source and the ADT7310
must be considered.
When the thermal impedance is determined, the temperature
of the heat source can be inferred from the ADT7310 output.
As much as 60% of the heat transferred from the heat source to
the thermal sensor on the ADT7310 die is discharged via the
copper tracks and the bond pads. Of the pads on the ADT7310,
the GND pad transfers most of the heat. Therefore, to measure
the temperature of a heat source, it is recommended that the
thermal resistance between the ADT7310 GND pad and the
GND of the heat source be reduced as much as possible.
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