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参数资料
| 型号： | ADT7461AARMZ-2RL7 |
| 厂商： | ON SEMICONDUCTOR |
| 元件分类： | 温度/湿度传感器 |
| 英文描述： | DIGITAL TEMP SENSOR-SERIAL, 8BIT(s), 2.5Cel, SQUARE, SURFACE MOUNT |
| 封装： | LEAD FREE MSOP-8 |
| 文件页数： | 9/19页 |
| 文件大小： | 276K |
| 代理商： | ADT7461AARMZ-2RL7 |
ADT7461A
http://onsemi.com
17
If it is not, the thermal inertia caused by the sensor’s mass
causes a lag in the response of the sensor to a temperature
change. In the case of the remote sensor, this should not be
a problem since it is either a substrate transistor in the
processor or a small package device, such as the SOT23,
placed in close proximity to it.
The onchip sensor, however, is often remote from the
processor and only monitors the general ambient
temperature around the package. How accurately the
temperature of the board and/or the forced airflow reflects
the temperature to be measured dictates the accuracy of the
measurement. Selfheating due to the power dissipated in
the ADT7461A or the remote sensor causes the chip
temperature of the device or remote sensor to rise above
ambient. However, the current forced through the remote
sensor is so small that selfheating is negligible. In the case
of the ADT7461A, the worstcase condition occurs when
the device is converting at 64 conversions per second while
sinking the maximum current of 1 mA at the ALERT and
THERM output. In this case, the total power dissipation in
the device is about 4.5 mW. The thermal resistance,
qJA, of
the 8lead MSOP is approximately 142
°C/W.
Layout Considerations
Digital boards can be electrically noisy environments, and
the ADT7461A is measuring very small voltages from the
remote sensor, so care must be taken to minimize noise
induced at the sensor inputs. Take the following precautions:
Place the ADT7461A as close as possible to the remote
sensing diode. Provided that the worst noise sources,
that is, clock generators, data/address buses, and CRTs
are avoided, this distance can be 4 inches to 8 inches.
Route the D+ and D– tracks close together, in parallel,
with grounded guard tracks on each side. To minimize
inductance and reduce noise pickup, a 5 mil track width
and spacing is recommended. Provide a ground plane
under the tracks, if possible.
Figure 22. Typical Arrangement of Signal Tracks
GND
D+
D–
GND
5 MIL
Try to minimize the number of copper/solder joints that
can cause thermocouple effects. Where copper/solder
joints are used, make sure that they are in both the D+
and D path and at the same temperature.
Thermocouple effects should not be a major problem as
1
°C corresponds to about 200 mV, and thermocouple
voltages are about 3 mV/
°C of temperature difference.
Unless there are two thermocouples with a big
temperature differential between them, thermocouple
voltages should be much less than 200 mV.
Place a 0.1 mF bypass capacitor close to the VDD pin. In
extremely noisy environments, place an input filter
capacitor across D+ and D close to the ADT7461A.
This capacitance can effect the temperature
measurement, so ensure that any capacitance seen at D+
and D is, at maximum, 1,000 pF. This maximum value
includes the filter capacitance, plus any cable or stray
capacitance between the pins and the sensor diode.
If the distance to the remote sensor is more than 8
inches, the use of twisted pair cable is recommended. A
total of 6 feet to 12 feet is needed.
For really long distances (up to 100 feet), use a shielded
twisted pair, such as the Belden No. 8451 microphone
cable. Connect the twisted pair to D+ and D and the
shield to GND close to the ADT7461A. Leave the
remote end of the shield unconnected to avoid ground
loops.
Because the measurement technique uses switched
current sources, excessive cable or filter capacitance can
affect the measurement. When using long cables, the filter
capacitance can be reduced or removed.
Application Circuit
Figure 23 shows a typical application circuit for the
ADT7461A, using a discrete sensor transistor connected via
a shielded, twisted pair cable. The pullups on SCLK,
SDATA, and ALERT are required only if they are not
provided elsewhere in the system.
The SCLK pin and the SDATA pin of the ADT7461A can
be interfaced directly to the SMBus of an I/O controller, such
as the IntelR 820 chipset..
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相关代理商/技术参数 |
参数描述 |
|---|---|
| ADT7461AARMZ-R | 功能描述:板上安装温度传感器 1 TMP DIO MON W/SMBUS ITF RoHS:否 制造商:Omron Electronics 输出类型:Digital 配置: 准确性:+/- 1.5 C, +/- 3 C 温度阈值: 数字输出 - 总线接口:2-Wire, I2C, SMBus 电源电压-最大:5.5 V 电源电压-最小:4.5 V 最大工作温度:+ 50 C 最小工作温度:0 C 关闭: 安装风格: 封装 / 箱体: 设备功能:Temperature and Humidity Sensor |
| ADT7461AARMZ-REEL | 功能描述:IC SENSOR TEMP DGTL 2CH 8-MSOP RoHS:是 类别:集成电路 (IC) >> PMIC - 热管理 系列:- 标准包装:1 系列:- 功能:温度监控系统（传感器） 传感器类型:内部和外部 感应温度:-40°C ~ 125°C，外部传感器 精确度:±2.5°C 本地（最大值），±5°C 远程（最大值） 拓扑:ADC，比较器，寄存器库 输出类型:2 线 SMBus? 输出警报:无 输出风扇:无 电源电压:2.7 V ~ 5.5 V 工作温度:-40°C ~ 125°C 安装类型:表面贴装 封装/外壳:SOT-23-8 供应商设备封装:SOT-23-8 包装:Digi-Reel® 其它名称:296-22675-6 |
| ADT7461AARMZ-REEL7 | 功能描述:IC SENSOR TEMP DGTL 2CH 8-MSOP RoHS:是 类别:集成电路 (IC) >> PMIC - 热管理 系列:- 标准包装:1 系列:- 功能:温度监控系统（传感器） 传感器类型:内部和外部 感应温度:-40°C ~ 125°C，外部传感器 精确度:±2.5°C 本地（最大值），±5°C 远程（最大值） 拓扑:ADC，比较器，寄存器库 输出类型:2 线 SMBus? 输出警报:无 输出风扇:无 电源电压:2.7 V ~ 5.5 V 工作温度:-40°C ~ 125°C 安装类型:表面贴装 封装/外壳:SOT-23-8 供应商设备封装:SOT-23-8 包装:Digi-Reel® 其它名称:296-22675-6 |
| ADT7461AARMZ-RL7 | 功能描述:板上安装温度传感器 1 TMP DIO MON W/SMBUS ITF RoHS:否 制造商:Omron Electronics 输出类型:Digital 配置: 准确性:+/- 1.5 C, +/- 3 C 温度阈值: 数字输出 - 总线接口:2-Wire, I2C, SMBus 电源电压-最大:5.5 V 电源电压-最小:4.5 V 最大工作温度:+ 50 C 最小工作温度:0 C 关闭: 安装风格: 封装 / 箱体: 设备功能:Temperature and Humidity Sensor |
| ADT7461AEBZEVB | 功能描述:BOARD EVAL FOR ADT7461 RoHS:是 类别:编程器，开发系统 >> 过时/停产零件编号 系列:- 标准包装:1 系列:- 传感器类型:CMOS 成像，彩色（RGB） 传感范围:WVGA 接口:I²C 灵敏度:60 fps 电源电压:5.7 V ~ 6.3 V 嵌入式:否 已供物品:成像器板 已用 IC / 零件:KAC-00401 相关产品:4H2099-ND - SENSOR IMAGE WVGA COLOR 48-PQFP4H2094-ND - SENSOR IMAGE WVGA MONO 48-PQFP |
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