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| 型号： | ADUC7020BCPZ62 |
| 厂商： | Analog Devices Inc |
| 文件页数： | 28/104页 |
| 文件大小： | 0K |
| 描述： | IC MCU FLSH 62K ANLG I/O 40LFCSP |
| 产品培训模块： | ARM7 Applications & Tools Intro to ARM7 Core & Microconverters Process Control |
| 标准包装： | 1 |
| 系列： | MicroConverter® ADuC7xxx |
| 核心处理器： | ARM7 |
| 芯体尺寸： | 16/32-位 |
| 速度： | 44MHz |
| 连通性： | EBI/EMI，I²C，SPI，UART/USART |
| 外围设备： | PLA，PWM，PSM，温度传感器，WDT |
| 输入/输出数： | 14 |
| 程序存储器容量： | 64KB（32K x 16） |
| 程序存储器类型： | 闪存 |
| RAM 容量： | 2K x 32 |
| 电压 - 电源 (Vcc/Vdd)： | 2.7 V ~ 3.6 V |
| 数据转换器： | A/D 5x12b; D/A 4x12b |
| 振荡器型： | 内部 |
| 工作温度： | -40°C ~ 125°C |
| 封装/外壳： | 40-VFQFN 裸露焊盘，CSP |
| 包装： | 托盘 |
| 配用： | EVAL-ADUC7020QSZ-ND - KIT DEV ADUC7020 QUICK START EVAL-ADUC7020MKZ-ND - KIT MINI DEV FOR ADUC7020 |
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Data Sheet
ADuC7019/20/21/22/24/25/26/27/28/29
Rev. F | Page 3 of 104
REVISION HISTORY
5/13—Rev. E to Rev. F
Changes to Figure 1...........................................................................1
Added Figure 2 to Figure 10; Renumbered Sequentially.............4
Changes to Figure 19; Added Figure 20 .......................................21
Changes to EPAD Note in Figure 21 and Figure 22..................... 22
Changes to EPAD Note in Table 11.................................................... 23
Changes to EPAD Note in Figure 23 ............................................25
Changes to EPAD Note in Table 12 ..............................................26
Changes to Table 14 ........................................................................31
Changes to Table 15 ........................................................................33
Changes to Table 82 ........................................................................68
Added Table 83, Figure 73, Figure 74, Following Text, and
Table 84; Renumbered Sequentially..............................................69
Changes to Bit 2 Description, Table 98 ........................................71
Changes to Table 101 ......................................................................72
Changes to Timer2 (Wake-Up Timer) Section ...........................87
Changes to Figure 94 ......................................................................95
Updated Outline Dimensions........................................................97
Changes to Ordering Guide.........................................................101
7/12—Rev. D to Rev. E
Changed SCLOCK to SCLK When Refering to SPI Clock,
SPIMISO to MISO when Refering to SPI MISO, SPIMOSI to
MOSI when Refering to SPI MOSI, and SPICSL to CS when
Refering to SPI Chip Select...............................................Universal
Changes to Table 4, Table 5, and Figure 5....................................11
Changes to Endnote 1 in Table 6 and Figure 6............................12
Changes to Table 7 and Figure 7 ...................................................13
Changes to Table 8 and Figure 8 ...................................................14
Changes to Table 9 and Figure 9 ...................................................15
Changed EPAD Note in Figure 12 and Table 11.........................18
Changed EPAD Note in Figure 13 and Table 12.........................21
Changes to Bit 6 in Table 18...........................................................43
Changes to Example Source Code (External Crystal Selection)
Section and Example Source Code (External Clock Selection)
Section...............................................................................................55
Changes to Serial Peripheral Interface Section ...........................69
Changes to SPICON[10] and SPICON[9] Descriptions in
Table 123............................................................................................70
Changes to Timer Interval Down Equation and Added Timer
Interval Up Equation ......................................................................79
Added Hour:Minute:Second:1/128 Format Section...................80
Changes to Table 189 ......................................................................84
Removed CP-40-10 Package ..........................................................92
Changes to Ordering Guide...........................................................96
5/11—Rev. C to Rev. D
Changes to Table 4 ..........................................................................11
Changes to Table 105 ......................................................................67
Updated Outline Dimensions........................................................91
Changes to Ordering Guide...........................................................94
12/09—Rev. B to Rev. C
Added ADuC7029 Part ..................................................... Universal
Added Table Numbers and Renumbered Tables............... Universal
Changes to Figure Numbers ............................................. Universal
Changes to Table 1 ............................................................................6
Changes to Figure 3 .........................................................................9
Changes to Table 3 and Figure 4 ...................................................10
Changes to Table 10 ........................................................................16
Changes to Figure 55 ......................................................................53
Changes to Serial Peripheral Interface Section ...........................69
Changes to Table 137......................................................................73
Changes to Figure 71 and Figure 72 .............................................85
Changes to Figure 73 and Figure 74 .............................................86
Updated Outline Dimensions........................................................91
Changes to Ordering Guide...........................................................94
3/07—Rev. A to Rev. B
Added ADuC7028 Part ..................................................... Universal
Updated Format ................................................................. Universal
Changes to Figure 2 ..........................................................................5
Changes to Table 1 ............................................................................6
Changes to ADuC7026/ADuC7027 Section ...............................23
Changes to Figure 21 ......................................................................28
Changes to Figure 32 Caption .......................................................30
Changes to Table 14 ........................................................................35
Changes to ADC Circuit Overview Section................................38
Changes to Programming Section................................................44
Changes to Flash/EE Control Interface Section..........................45
Changes to Table 24 ........................................................................47
Changes to RSTCLR Register Section..........................................48
Changes to Figure 52 ......................................................................49
Changes to Figure 53 ......................................................................50
Changes to Comparator Section ...................................................50
Changes to Oscillator and PLL—Power Control Section..........51
Changes to Digital Peripherals Section........................................54
Changes to Interrupt System Section ...........................................75
Changes to Timers Section ............................................................76
Changes to External Memory Interfacing Section .....................80
Added IOVDD Supply Sensitivity Section.....................................84
Changes to Ordering Guide...........................................................90
1/06—Rev. 0 to Rev. A
Changes to Table 1 ............................................................................6
Added the Flash/EE Memory Reliability Section .......................43
Changes to Table 30 ........................................................................52
Changes to Serial Peripheral Interface .........................................66
Changes to Ordering Guide...........................................................90
10/05—Revision 0: Initial Version
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| ADUC7020BCPZ62I | 功能描述:IC MCU FLSH 62K ANLG I/O 40LFCSP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - 微控制器， 系列:MicroConverter® ADuC7xxx 标准包装:60 系列:PSOC® 3 CY8C38xx 核心处理器:8051 芯体尺寸:8-位 速度:67MHz 连通性:EBI/EMI，I²C，LIN，SPI，UART/USART 外围设备:电容感应，DMA，LCD，POR，PWM，WDT 输入/输出数:25 程序存储器容量:64KB（64K x 8） 程序存储器类型:闪存 EEPROM 大小:2K x 8 RAM 容量:8K x 8 电压 - 电源 (Vcc/Vdd):1.71 V ~ 5.5 V 数据转换器:A/D 2x20b，D/A 4x8b 振荡器型:内部 工作温度:-40°C ~ 85°C 封装/外壳:48-VFQFN 裸露焊盘 包装:托盘 |
| ADUC7020BCPZ62I-RL | 功能描述:IC MCU 12BIT 1MSPS I2C 40-LFCSP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - 微控制器， 系列:MicroConverter® ADuC7xxx 标准包装:38 系列:Encore!® XP® 核心处理器:eZ8 芯体尺寸:8-位 速度:5MHz 连通性:IrDA，UART/USART 外围设备:欠压检测/复位，LED，POR，PWM，WDT 输入/输出数:16 程序存储器容量:4KB（4K x 8） 程序存储器类型:闪存 EEPROM 大小:- RAM 容量:1K x 8 电压 - 电源 (Vcc/Vdd):2.7 V ~ 3.6 V 数据转换器:- 振荡器型:内部 工作温度:-40°C ~ 105°C 封装/外壳:20-SOIC（0.295"，7.50mm 宽） 包装:管件 其它名称:269-4116Z8F0413SH005EG-ND |
| ADUC7020BCPZ62IRL7 | 功能描述:IC MCU 12BIT 1MSPS I2C 40-LFCSP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - 微控制器， 系列:MicroConverter® ADuC7xxx 标准包装:38 系列:Encore!® XP® 核心处理器:eZ8 芯体尺寸:8-位 速度:5MHz 连通性:IrDA，UART/USART 外围设备:欠压检测/复位，LED，POR，PWM，WDT 输入/输出数:16 程序存储器容量:4KB（4K x 8） 程序存储器类型:闪存 EEPROM 大小:- RAM 容量:1K x 8 电压 - 电源 (Vcc/Vdd):2.7 V ~ 3.6 V 数据转换器:- 振荡器型:内部 工作温度:-40°C ~ 105°C 封装/外壳:20-SOIC（0.295"，7.50mm 宽） 包装:管件 其它名称:269-4116Z8F0413SH005EG-ND |
| ADUC7020BCPZ62-RL | 制造商:Analog Devices 功能描述:MCU 16-Bit/32-Bit ADuC7xxx ARM7TDMI RISC 62KB Flash 3.3V 40-Pin LFCSP EP T/R |
| ADUC7020BCPZ62-RL7 | 功能描述:IC MCU 12BIT 1MSPS UART 40-LFCSP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - 微控制器， 系列:MicroConverter® ADuC7xxx 标准包装:38 系列:Encore!® XP® 核心处理器:eZ8 芯体尺寸:8-位 速度:5MHz 连通性:IrDA，UART/USART 外围设备:欠压检测/复位，LED，POR，PWM，WDT 输入/输出数:16 程序存储器容量:4KB（4K x 8） 程序存储器类型:闪存 EEPROM 大小:- RAM 容量:1K x 8 电压 - 电源 (Vcc/Vdd):2.7 V ~ 3.6 V 数据转换器:- 振荡器型:内部 工作温度:-40°C ~ 105°C 封装/外壳:20-SOIC（0.295"，7.50mm 宽） 包装:管件 其它名称:269-4116Z8F0413SH005EG-ND |
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