参数资料
型号: ADUC824BSZ
厂商: Analog Devices Inc
文件页数: 10/68页
文件大小: 0K
描述: IC MCU 8K FLASH ADC/DAC 52MQFP
标准包装: 1
系列: MicroConverter® ADuC8xx
核心处理器: 8052
芯体尺寸: 8-位
速度: 12.58MHz
连通性: EBI/EMI,I²C,SPI,UART/USART
外围设备: POR,PSM,温度传感器,WDT
输入/输出数: 34
程序存储器容量: 8KB(8K x 8)
程序存储器类型: 闪存
EEPROM 大小: 640 x 8
RAM 容量: 256 x 8
电压 - 电源 (Vcc/Vdd): 2.7 V ~ 5.25 V
数据转换器: A/D 3x16b,4x24b; D/A 1x12b
振荡器型: 内部
工作温度: -40°C ~ 85°C
封装/外壳: 52-QFP
包装: 托盘
REV. B
ADuC824
–18–
ABSOLUTE MAXIMUM RATINGS
1
(TA = 25
°C unless otherwise noted.)
AVDD to AGND . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
AVDD to DGND . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
DVDD to AGND . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
DVDD to DGND . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
AGND to DGND
2
. . . . . . . . . . . . . . . . . . . –0.3 V to +0.3 V
AVDD to DVDD . . . . . . . . . . . . . . . . . . . . . . . . . –2 V to +5 V
Analog Input Voltage to AGND
3 . . . . –0.3 V to AV
DD + 0.3 V
Reference Input Voltage to AGND . . –0.3 V to AVDD + 0.3 V
AIN/REFIN Current (Indefinite) . . . . . . . . . . . . . . . . 30 mA
Digital Input Voltage to DGND . . . –0.3 V to DVDD + 0.3 V
Digital Output Voltage to DGND . . –0.3 V to DVDD + 0.3 V
Operating Temperature Range . . . . . . . . . . . –40
°C to +85°C
Storage Temperature Range . . . . . . . . . . . . –65
°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . 150
°C
θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . . 90°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . 215
°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . 220
°C
NOTES
1Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
2AGND and DGND are shorted internally on the ADuC824.
3Applies to P1.2 to P1.7 pins operating in analog or digital input modes.
*Windows is a registered trademark of Microsoft Corporation.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the ADuC824 features proprietary ESD protection circuitry, permanent damage may occur on
devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are
recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
ORDERING GUIDE
Temperature
Package
Model
Range
Description
Option
ADuC824BS
–40
°C to +85°C
52-Lead Plastic
S-52
Quad Flatpack
QuickStart
Development
System Model
Description
EVAL-ADUC824QS
Development System for the ADuC824
MicroConverter, containing:
Evaluation Board
Serial Port Cable
Plug-In Power Supply
Windows Serial Downloader (WSD)
*
Windows Debugger (DeBug)
Windows ADuC824 Simulator
(ADSIM)
Windows ADC Analysis Software
Program (WASP)
8051 Assembler (Metalink)
C-Compiler (Keil) Evaluation Copy
Limited to 2 Kcode
Example Code
Documentation
PIN CONFIGURATION
52 51 50 49 48
43 42 41 40
47 46 45 44
14 15 16 17 18 19 20 21 22 23 24 25 26
1
2
3
4
5
6
7
8
9
10
11
13
12
PIN 1
IDENTIFIER
TOP VIEW
(Not to Scale)
39
38
37
36
35
34
33
32
31
30
29
28
27
ADuC824
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