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参数资料
| 型号： | ADUM3070ARQZ |
| 厂商： | Analog Devices Inc |
| 文件页数： | 17/20页 |
| 文件大小： | 0K |
| 描述： | IC REG PUSH-PLL CTRLR ISO 16SSOP |
| 标准包装： | 98 |
| 类型： | 推挽式控制器，隔离式 |
| 输出类型： | 可调式 |
| 输出数： | 1 |
| 输出电压： | 3.3 V ~ 24 V |
| 输入电压： | 3V，5V |
| 频率 - 开关： | 200kHz ~ 1MHz |
| 同步整流器： | 无 |
| 工作温度： | -40°C ~ 105°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 16-SSOP（0.154"，3.90mm 宽） |
| 包装： | 管件 |
| 供应商设备封装： | 16-QSOP |
Data Sheet
Table 14. Recommended Components
ADuM3070
The board layout shows enlarged pads for the GND x pins (Pin 2
Part Number
GRM32ER71A476KE15L
GRM32ER71C226KEA8L
GRM31CR71A106KA01L
MBR0540T1/D
Manufacturer
Murata
Murata
Murata
ON Semiconductor
Value
47 μF, 10 V, X7R,
1210
22 μF, 16 V, X7R,
1210
10 μF, 10 V, X7R,
1206
0.5 A, 40 V,
Schottky, SOD-123
and Pin 8) on Side 1 and (Pin 9 and Pin 15) on Side 2. Implement
large diameter vias from the pad to the ground planes and power
planes to increase thermal conductivity and to reduce inductance.
Multiple vias in the thermal pads can significantly reduce
temperatures inside the chip. The dimensions of the expanded
pads are left to the discretion of the designer and the available
board space.
THERMAL ANALYSIS
GND 1
LQH3NPN470MM0 Murata 47 μH, 0.41 A,
1212
ME3220-104KL Coilcraft 100 μH, 0.34 A,
1210
PRINTED CIRCUIT BOARD (PCB) LAYOUT
Note that the total lead length between the ends of the low ESR
capacitor and the V DDx and GND x pins must not exceed 2 mm. See
X1 V REG
GND 2
NC V DD2
X2 FB
The ADuM3070 parts consist of two internal die attached to a
split lead frame with two die attach paddles. For the purposes of
thermal analysis, the die is treated as a thermal unit, with the
The value of θ JA is based on measurements taken with the devices
mounted on a JEDEC standard, 4-layer board with fine width traces
and still air. Under normal operating conditions, the ADuM3070
devices operate at full load across the full temperature range
without derating the output current. However, following the
section decreases thermal resistance to the PCB, allowing increased
thermal margins in high ambient temperatures. The ADuM3070
TP
NC
has a thermal shutdown circuit that shuts down the dc-to-dc
V DDA
GND 1
TP
NC
OC
GND 2
converter of the ADuM3070 when a die temperature of about
160°C is reached. When the die cools below about 140°C, the
ADuM3070 dc-to-dc converter turns on again.
Figure 34. Recommended PCB Layout
In applications involving high common-mode transients, ensure
that board coupling across the isolation barrier is minimized.
Furthermore, design the board layout such that any coupling
that does occur equally affects all pins on a given component side.
Failure to ensure this can cause voltage differentials between pins,
thereby leading to latch-up and/or permanent damage.
The ADuM3070 is a power device that dissipates about 1 W of
power when fully loaded. Because it is not possible to apply a
heat sink to an isolation device, the device primarily depends on
heat dissipation into the PCB through the GND x pins. If the device
is used at high ambient temperatures, care must be taken to provide
a thermal path from the GND x pins to the PCB ground plane.
POWER CONSUMPTION
The total input supply current is equal to the sum of the I DD1 primary
transformer current and the ADuM3070 input current, I DDA .
The following relationship allows the total I IN current to be:
I IN = ( I ISO × V ISO )/( E × V DD1 ) (1)
where:
I IN is the total supply input current.
I ISO is the current drawn by the secondary side external load.
E is the power supply efficiency at the given output load from
I IN
V DD1
I DD1
X1
X2
RECT
V REG
V ISO I ISO
ADuM3070
REG
V DD2
V DDA
I DDA
PRIMARY
CONVERTER/
DRIVER
SECONDARY
FB
5V
CONTROLLER
GND1
INTERNAL
FEEDBACK
GND2
OC
NOTES
1. V DD1 IS THE POWER SUPPLY FOR THE PUSH-PULL TRANSFORMER.
2. V DDA IS THE POWER SUPPLY OF SIDE 1 OF THE ADuM3070.
Figure 35. Supply Currents
Rev. 0 | Page 17 of 20
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