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| 型号： | ADUM6404CRWZ-RL |
| 厂商： | Analog Devices Inc |
| 文件页数： | 2/28页 |
| 文件大小： | 0K |
| 描述： | IC ISOLATOR 4CH DCDC CONV 16SOIC |
| 标准包装： | 1,000 |
| 系列： | IsoPower®, iCoupler® |
| 输入 - 1 侧/2 侧： | 0/4 |
| 通道数： | 4 |
| 电源电压： | 4.25V，5V |
| 电压 - 隔离： | 5000Vrms |
| 数据速率： | 25Mbps |
| 传输延迟： | 60ns |
| 输出类型： | 逻辑 |
| 封装/外壳： | 16-SOIC（0.295"，7.50mm 宽） |
| 供应商设备封装： | 16-SOIC W |
| 包装： | 带卷 (TR) |
| 工作温度： | -40°C ~ 105°C |
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ADuM6400/ADuM6401/ADuM6402/ADuM6403/ADuM6404
TABLE OF CONTENTS
Data Sheet
Features .............................................................................................. 1 ?
Applications ....................................................................................... 1 ?
General Description ......................................................................... 1 ?
Functional Block Diagrams ............................................................. 1 ?
Revision History ............................................................................... 2 ?
Specifications..................................................................................... 3 ?
Electrical Characteristics—5 V Primary Input Supply/
5 V Secondary Isolated Supply ................................................... 3 ?
Electrical Characteristics—3.3 V Primary Input Supply/
3.3 V Secondary Isolated Supply ................................................ 5 ?
Electrical Characteristics—5 V Primary Input Supply/
3.3 V Secondary Isolated Supply ................................................ 6 ?
Package Characteristics ............................................................... 8 ?
Regulatory Information ............................................................... 9 ?
Insulation and Safety-Related Specifications ............................ 9 ?
Insulation Characteristics.......................................................... 10 ?
Recommended Operating Conditions .................................... 10 ?
Absolute Maximum Ratings.......................................................... 11 ?
ESD Caution ................................................................................ 11 ?
REVISION HISTORY
4 /1 2 —Rev. 0 to Rev. A
Changes to Features Section, General Description Section,
and Table 1 ......................................................................................... 1
Changes to Table 2 and Table 3 ....................................................... 3
Changes to Endnote 1 in Table 5 .................................................... 4
Changes to Table 6 and Table 7 ....................................................... 5
Change to Propagation Delay Parameter in Table 8 .................... 5
Changes to Endnote 1 in Table 9; Changes to Table 10 ............... 6
Changes to Table 11 .......................................................................... 7
Changes to Endnote 1 in Table 13; Changes to Table 14 ............. 8
Changes to Regulatory Information Section, Table 15,
and Table 16 ....................................................................................... 9
Changes to Insulation Characteristics Section, Table 17,
and Table 18 ..................................................................................... 10
Changes to Table 20 ........................................................................ 11
Changes to Table 26 ........................................................................ 16
Changes to Figure 13, Figure 14, Figure 15, Figure 17,
Pin Configurations and Function Descriptions ......................... 12 ?
Truth Table .................................................................................. 16 ?
Typical Performance Characteristics ........................................... 17 ?
Terminology .................................................................................... 20 ?
Applications Information .............................................................. 21 ?
PCB Layout ................................................................................. 21 ?
Start-Up Behavior....................................................................... 21 ?
EMI Considerations ................................................................... 22 ?
Propagation Delay Parameters ................................................. 22 ?
DC Correctness and Magnetic Field Immunity ..................... 22 ?
Power Consumption .................................................................. 23 ?
Current Limit and Thermal Overload Protection ................. 24 ?
Power Considerations ................................................................ 24 ?
Thermal Analysis ....................................................................... 25 ?
Insulation Lifetime ..................................................................... 25 ?
Outline Dimensions ....................................................................... 26 ?
Ordering Guide .......................................................................... 27 ?
Changes to Figure 19 and Figure 20............................................. 18
Added Figure 21 and Figure 22; Renumbered
Figures Sequentially ....................................................................... 18
Added Definition of I ISO(LOAD) to Terminology Section .............. 20
Changes to PCB Layout Section ................................................... 21
Added Start-Up Behavior Section ................................................ 21
Changes to EMI Considerations Section .................................... 22
Moved Propagation Delay Parameters Section .......................... 22
Changes to Power Consumption Section .................................... 23
Added Current Limit and Thermal Overload Protection
Section.............................................................................................. 24
Moved Thermal Analysis Section ................................................ 25
Changes to Insulation Lifetime Section and Figure 33 ............. 25
Updated Outline Dimensions ....................................................... 26
Changes to Ordering Guide .......................................................... 27
5/09—Revision 0: Initial Version
and Figure 18 ................................................................................... 17
Rev. A | Page 2 of 28
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