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-27-
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www.astec.com
Thermal Management
T
Technologies
echnologies
AEH Series 50 W to 150 W modules feature
high efficiency and the 2.5 V output units have
typical efficiency of 86% at full load. With less
heat dissipation and temperature-resistant
components such as ceramic capacitors, these
modules exhibit good behavior during pro-
longed
exposure
to
high
temperatures.
Maintaining the operating case temperature
(Tc) within the specified range help keep inter-
nal-component temperatures within their speci-
fications which in turn help keep MTBF from
falling below the specified rating. Proper cool-
ing of the power modules is also necessary for
reliable and consistent operation.
Basic Thermal Management
Measuring the case temperature of the module
(Tc) as the method shown in Figure 22 can ver-
ify the proper cooling. Figure 22 shows the
metal surface of the module and the pin loca-
tions. The module should work under 90°C for
the reliability of operation and TC must not
exceed 100 ° C while operating in the final sys-
tem configuration. The measurement can be
made with a surface probe after the module has
reached thermal equilibrium. If a heat sink is
mounted to the case, make the measurement
as close as possible to the indicated position. It
makes the assumption that the final system
configuration exists and can be used for a test
environment.
The following text and graphs show guidelines
to predict the thermal performance of the mod-
ule for typical configurations that include heat
sinks in natural or forced airflow environments.
Note that Tc of module must always be checked
in the final system configuration to verify proper
operational due to the variation in test condi-
tions.
Thermal management acts to transfer the heat
dissipated by the module to the surrounding
environment. The amount of power dissipated
by the module as heat (PD) is got by the equa-
tion below:
PD = PI PO
where : PI is input power;
PO is output power;
PD is dissipated power.
Also, module efficiency (
η) is defined as the fol-
lowing equation:
η = PO / PI
If eliminating the input power term, from two
above equations can yield the equation below:
PD = PO (1-
η )/ η
The module power dissipation then can be cal-
culated through the equation.
Because each power module output voltage
has a different power dissipation curve, a plot of
power dissipation versus output current over
three different line voltages is given in each
module-specific data sheet. The typical power
dissipation curve of AEH series 2.5V output are
shown as figure 23 to figure 26.
29.0 (1.14)
30.5 (1.2)
CNT
Case
+Sense
Trim
– Sense
+Vin
MEASURE CASE
TEMPERATURE HERE
Base-plate side View
Dimensions: millimeters (inches)
-Vin
+Vout
-Vout
Fig.22 Case Temperature Measurement