
AF1333P
P-Channel Enhancement Mode Power MOSFET
Anachip Corp.
www.anachip.com.tw
Rev. 1.0 Oct 15, 2004
2/5
Absolute Maximum Ratings
Symbol
Parameter
Rating
Unit
VDS
Drain-Source Voltage
-20
V
VGS
Gate-Source Voltage
±12
V
TA=25C
-550
ID
Continuous Drain Current (Note 1)
TA=70C
-440
mA
IDM
Pulsed Drain Current (Note 2, 3)
-2.5
A
Total Power Dissipation
TA=25C
0.35
W
PD
Linear Derating Factor
0.003
W/
oC
TSTG
Storage Temperature Range
-55 to +150
oC
TJ
Operating Junction Temperature Range
-55 to +150
oC
Thermal Data
Symbol
Parameter
Value
Unit
Rthj-a
Thermal Resistance Junction-Ambient (Note 1)
Max.
360
C/W
Electrical Characteristics at T
A=25
oC (unless otherwise specified)
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
BVDSS
Drain-Source Breakdown Voltage VGS=0V, ID=-250uA
-20
-
V
BVDSS / TJ
Breakdown Voltage Temperature
Coefficient
Reference to 25
oC,
ID=-1mA
-
0.01
-
V/
oC
VGS=-10V, ID=-550mA
-
600
VGS=-4.5V, ID=-550mA
-
800
RDS(ON)
Static Drain-Source
On-Resistance
VGS=-2.5V, ID=-300mA
-
1000
m
VGS(th)
Gate Threshold Voltage
VDS=VGS, ID=-250uA
-0.5
-
-1.2
V
gfs
Forward Transconductance
VDS=-5V, ID=-500mA
-
1
-
S
Drain-Source Leakage Current
(TJ=25
oC)
VDS=-20V, VGS=0V
-
-1
IDSS
Drain-Source Leakage Current
(TJ=70
oC)
VDS=-16V, VGS=0V
-
-10
uA
IGSS
Gate-Source Leakage
VGS=±12V
-
±100
nA
Qg
Total Gate Charge (Note 3)
-
1.7
2.7
Qgs
Gate-Source Charge
-
0.3
-
Qgd
Gate-Drain (“Miller”) Charge
ID=-500mA,
VDS=-16V,
VGS=-4.5V
-
0.4
-
nC
td(on)
Turn-On Delay Time (Note 3)
-
5
-
tr
Rise Time
-
8
-
td(off)
Turn-Off Delay Time
-
10
-
tf
Fall-Time
VDS=-10V,
ID=-500mA,
RG=3.3, VGS=-5V
RD=20
-
2
-
ns
Ciss
Input Capacitance
-
66
105.6
Coss
Output Capacitance
-
25
-
Crss
Reverse Transfer Capacitance
VGS=0V,
VDS=-10V,
f=1.0MHz
-
20
-
pF
Source-Drain Diode
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
VDS
Forward On Voltage (Note 3)
IS=-300mA, VGS=0V
-
-1.2
V
Note 1: Surface mounted on FR4 board, t ≤ 10 sec.
Note 2: Pulse width limited by Max. junction temperature.
Note 3: Pulse width ≤ 300us, duty cycle ≤ 2%.