参数资料
型号: AFCT-5964NLZ
元件分类: 光收发
英文描述: FIBER OPTIC TRANSCEIVER, 1261-1580nm, 155Mbps(Tx), 155Mbps(Rx), BOARD/PANEL MOUNT, DIP, LC CONNECTOR
封装: ROHS COMPLIANT, DIP-20
文件页数: 11/16页
文件大小: 497K
代理商: AFCT-5964NLZ
4
Figure 3. Block Diagram
Package
The overall package concept for these devices
consists of the following basic elements; two
optical subassemblies, a electrical subassembly
and the housing as illustrated in the block
diagram in Figure 3.
The package outline drawing and pin out are
shown in Figures 4 and 5. The details of this
package outline and pin out are compliant
with the multisource definition of the 2 x 10
DIP. The low profile of the Avago Technologies
transceiver design complies with the maximum
height allowed for the LC connector over the
entire length of the package.
The electrical subassembly consists of
high
volume multilayer printed circuit board on which
the IC and various surface-mounted passive
circuit elements are attached.
The optical subassemblies are attached to the
electrical subassembly. These two units are
then fitted within the outer housing of the
transceiver. The housing is then encased with
a metal EMI protective shield.
The electrical subassembly carries the signal
pins that exit from the bottom of the transceiver.
The solder posts are designed to provide the
mechanical strength required to withstand the
loads imposed on the transceiver by mating
with the LC connectored fiber cables. Although
they are not connected electrically to the
transceiver, it is recommended to connect them
to chassis ground.
DATA OUT
SIGNAL
DETECT
DATA IN
Tx DISABLE
QUANTIZER IC
LASER DRIVER
AND CONTROL
CIRCUIT
PIN PHOTODIODE
PREAMPLIFIER
SUBASSEMBLY
LASER
OPTICAL
SUBASSEMBLY
DATA OUT
LC
RECEPTACLE
R
X SUPPLY
T
X SUPPLY
R
X GROUND
T
X GROUND
LASER BIAS
MONITORING
LASER DIODE
MODULATOR
CASE
NOTE
NOTE: NOSE CLIP PROVIDES CONNECTION TO CHASSIS GROUND FOR BOTH EMI AND THERMAL DISSIPATION.
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相关代理商/技术参数
参数描述
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