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参数资料
| 型号： | AG103 |
| 元件分类： | 放大器 |
| 英文描述： | 50 MHz - 870 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER |
| 封装： | TO-243C, SOT-89, 3 PIN |
| 文件页数： | 4/5页 |
| 文件大小： | 336K |
| 代理商： | AG103 |
Specifications and information are subject to change without notice.
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com
Page 4 of 5
June 2005
AG103
High Dynamic Range Gain Block
Product Information
The Communications Edge TM
AG103 (SOT-89 Package) Mechanical Information
This package may contain lead-bearing materials. The plating material on the leads is SnPb.
Outline Drawing
Land Pattern
Thermal Specifications
Parameter
Rating
Operating Case Temperature
-40 to +85
qC
Thermal Resistance, Rth (1)
59
q C / W
Junction Temperature, Tjc (2)
129
q C
1. The thermal resistance is referenced from the hottest
part of the junction to the ground tab (pin 4).
2. This corresponds to the typical biasing condition of
+5V, 150 mA at an 85¤ C case temperature.
A
minimum MTTF of 1 million hours is achieved for
junction temperatures below 160 ¤ C.
Product Marking
The AG103 will be marked with an “AG103”
designator.
An alphanumeric lot code
(“XXXX-X” ) is also marked below the part
designator on the top surface of the package.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
MSL / ESD Rating
ESD Rating: Class 1B
Value:
Passes
500V to <1000V
Test:
Human Body Model (HBM)
Standard:
JEDEC Standard JESD22-A114
ESD Rating: Class IV
Value:
Passes
1000V to <2000V
Test:
Charged Device Model (CDM)
Standard:
JEDEC Standard JESD22-C101
MSL Rating: Level 3 at +235¤ C convection reflow
Standard:
JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper
performance of this device. Vias should use a .35mm
(#80 / .0135” ) diameter drill and have a final plated
thru diameter of .25 mm (.010” ).
2. Add as much copper as possible to inner and outer
layers near the part to ensure optimal thermal
performance.
3. Mounting screws can be added near the part to fasten
the board to a heatsink. Ensure that the ground /
thermal via region contacts the heatsink.
4. Do not put solder mask on the backside of the PC board
in the region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material
and construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are
in degrees.
MTTF vs. GND Tab Temperature
1
10
100
1000
60
70
80
90
100
110
Tab Temperature (°C)
M
T
F
(m
il
li
o
n
h
rs
)
相关PDF资料 |
PDF描述 |
|---|---|
| AG103 | 50 MHz - 870 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER |
| AG402-86G | 0 MHz - 6000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| AG402-86G | 0 MHz - 6000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| AG402-89G | 0 MHz - 6000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| AG503-86G | 0 MHz - 6000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
相关代理商/技术参数 |
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|---|---|
| AG103_06 | 制造商:WJCI 制造商全称:WJCI 功能描述:High Dynamic Range Gain Block |
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| AG103-PCB | 功能描述:射频开发工具 50-870MHz Eval Brd 20dBm 13dB Gain RoHS:否 制造商:Taiyo Yuden 产品:Wireless Modules 类型:Wireless Audio 工具用于评估:WYSAAVDX7 频率: 工作电源电压:3.4 V to 5.5 V |
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