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参数资料
| 型号： | AG602-89 |
| 元件分类： | 放大器 |
| 英文描述： | 0 MHz - 3500 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| 封装： | TO-243C, SOT-89, 3 PIN |
| 文件页数： | 5/6页 |
| 文件大小： | 495K |
| 代理商： | AG602-89 |
Specifications and information are subject to change without notice
WJ Communications, Inc
Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com
Page 5 of 6 June 2005
AG602-89
InGaP HBT Gain Block
Product Information
AG602-89 (SOT-89 Package) Mechanical Information
This package may contain lead-bearing materials. The plating material on the leads is SnPb.
Outline Drawing
Land Pattern
Thermal Specifications
Parameter
Rating
Operating Case Temperature
-40 to +85
°C
Thermal Resistance, Rth (1)
154
° C/W
Junction Temperature, Tjc (2)
145
° C
1. The thermal resistance is referenced from the hottest
part of the junction to the ground tab (pin 4).
2. This corresponds to the typical biasing condition of
+5.16V, 75 mA at an 85
°C case temperature. A
minimum MTTF of 1 million hours is achieved for
junction temperatures below 177
°C.
Product Marking
The AG602-89 will be marked with an
“AG602” designator. An alphanumeric lot
code (“XXXX-X”) is also marked below the
part designator on the top surface of the
package.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
MSL / ESD Rating
ESD Rating: Class 0
Value:
Passes at 150 V
Test:
Human Body Model (HBM)
Standard:
JEDEC Standard JESD22-A114
ESD Rating: Class II
Value:
Passes at 250 V
Test:
Charged Device Model (CDM)
Standard:
JEDEC Standard JESD22-C101
MSL Rating: Level 3 at +235
° C convection reflow
Standard:
JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper performance of
this device. Vias should use a .35mm (#80 / .0135”) diameter
drill and have a final plated thru diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer layers near
the part to ensure optimal thermal performance.
3. Mounting screws can be added near the part to fasten the board
to a heatsink. Ensure that the ground / thermal via region
contacts the heatsink.
4. Do not put solder mask on the backside of the PC board in the
region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material and
construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are in
degrees.
MTTF vs. GND Tab Temperature
1
10
100
1000
60
70
80
90
100
110
120
Tab Temperature (°C)
M
TTF
(
m
il
li
on
hr
s
)
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相关代理商/技术参数 |
参数描述 |
|---|---|
| AG602-89G | 功能描述:射频放大器 DC-3500MHz 14dB Gain@900MHz RoHS:否 制造商:Skyworks Solutions, Inc. 类型:Low Noise Amplifier 工作频率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 输出截获点:37.5 dBm 功率增益类型:32 dB 噪声系数:0.85 dB 工作电源电压:5 V 电源电流:125 mA 测试频率:2.6 GHz 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-16 封装:Reel |
| AG602-89PCB | 功能描述:射频开发工具 700-2400MHz Eval Brd 18.5dBm 14dB Gain RoHS:否 制造商:Taiyo Yuden 产品:Wireless Modules 类型:Wireless Audio 工具用于评估:WYSAAVDX7 频率: 工作电源电压:3.4 V to 5.5 V |
| AG602-89-RFID | 制造商:WJCI 制造商全称:WJCI 功能描述:InGaP HBT Gain Block |
| AG602-89TRG | 制造商:TriQuint Semiconductor 功能描述:GAIN BLOCK |
| AG603 | 制造商:未知厂家 制造商全称:未知厂家 功能描述:InGaP HBT Gain Block |
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