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参数资料
型号： AGLE600V2-FGG484I
厂商： Microsemi SoC
文件页数： 100/166页
文件大小： 0K
描述： IC FPGA 1KB FLASH 600K 484-FBGA
标准包装： 60
系列： IGLOOe
逻辑元件/单元数： 13824
RAM 位总计： 110592
输入/输出数： 270
门数： 600000
电源电压： 1.14 V ~ 1.575 V
安装类型： 表面贴装
工作温度： -40°C ~ 85°C
封装/外壳： 484-BGA
供应商设备封装： 484-FPBGA（23x23）
IGLOOe Low Power Flash FPGAs
Revision 13
2-25
Table 2-25 Summary of I/O Timing Characteristics—Software Default Settings
Std. Speed Grade, Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V,
Worst-Case VCCI (per standard)
I/O Standard
D
rive
S
tre
ng
th
(mA)
Eq
ui
va
le
nt
Sof
twar
eDefau
lt
D
rive
S
tre
ng
th
Op
tio
n
1 (m
A)
Slew
Rate
C
ap
a
citive
L
o
a
d
(pF
)
Ex
tern
al
Re
sistor
(
)
t DO
U
T
(ns)
t DP
(ns)
t DI
N
(ns)
t PY
(ns)
t PYS
(ns)
t EOUT
(ns)
t ZL
(ns)
t ZH
(ns)
t LZ
(ns)
t HZ
(ns)
t ZL
S
(ns)
t ZH
S
(n
s)
Un
it
s
3.3 V LVTTL /
3.3 V LVCMOS
12
High 5
–
0.97 2.12 0.18 1.08 1.34 0.66 2.17 1.69 2.71 3.08 5.76 5.28 ns
3.3 V LVCMOS
Wide Range1, 2
100 A
12
High
5
–
0.972.960.181.421.840.662.982.283.864.366.585.87 ns
2.5 V LVCMOS
12
High
5
–
.097 2.15 0.18 1.31 1.41 0.66 2.20 1.85 2.78 2.98 5.80 5.45 ns
1.8 V LVCMOS
12
High 5
–
0.97 2.37 0.18 1.27 1.59 0.66 2.42 2.03 3.07 3.57 6.02 5.62 ns
1.5 V LVCMOS
12
High 5
–
0.97 2.69 0.18 1.47 1.77 0.66 2.75 2.30 3.24 3.67 6.35 5.89 ns
3.3 V PCI
Per
PCI
spec
–
High 10 25 3 0.97 2.38 0.18 0.96 1.42 0.66 2.43 1.80 2.72 3.08 6.03 5.39 ns
3.3 V PCI-X
Per
PCI-X
spec
–
High 10 25 3 0.97 2.38 0.19 0.92 1.34 0.66 2.43 1.80 2.72 3.08 6.03 5.39 ns
3.3 V GTL
204
–
High 10
25 0.97 1.78 0.19 2.35
–
0.66 1.80 1.78
–
5.39 5.38 ns
2.5 V GTL
204
–
High 10
25 0.97 1.85 0.19 1.98
–
0.66 1.89 1.82
–
5.49 5.42 ns
3.3 V GTL+
35
–
High 10
25 0.97 1.80 0.19 1.32
–
0.66 1.84 1.77
–
5.44 5.36 ns
2.5 V GTL+
33
–
High 10
25 0.97 1.92 0.19 1.26
–
0.66 1.96 1.80
–
5.56 5.40 ns
HSTL (I)
8
–
High 20
50 0.97 2.67 0.18 1.72
–
0.66 2.72 2.67
–
6.32 6.26 ns
HSTL (II)
15
–
High 20
25 0.97 2.55 0.18 1.72
–
0.66 2.60 2.34
–
6.20 5.93 ns
SSTL2 (I)
15
–
High 30
50 0.97 1.86 0.19 1.12
–
0.66 1.90 1.68
–
5.50 5.28 ns
SSTL2 (II)
18
–
High 30
25 0.97 1.89 0.19 1.12
–
0.66 1.93 1.62
–
5.53 5.22 ns
SSTL3 (I)
14
–
High 30
50 0.97 2.00 0.19 1.06
–
0.66 2.04 1.67
–
5.64 5.27 ns
SSTL3 (II)
21
–
High 30
25 0.97 1.81 0.19 1.06
–
0.66 1.85 1.55
–
5.45 5.14 ns
LVDS
24
–
High
–
– 0.97 1.73 0.19 1.62
––––––
––
ns
LVPECL
24
–
High
–
– 0.97 1.65 0.18 1.42
––––––
––
ns
Notes:
1. The minimum drive strength for any LVCMOS 1.2 V or LVCMOS 3.3 V software configuration when run in wide range is
±100 A. Drive strength displayed in the software is supported for normal range only. For a detailed I/V curve, refer to the
IBIS models.
2. All LVCMOS 3.3 V software macros support LVCMOS 3.3 V wide range as specified in the JESD8-B specification.
3. Resistance is used to measure I/O propagation delays as defined in PCI Specifications. See Figure 2-12 on page 2-49 for
connectivity. This resistor is not required during normal operation.
4. Output drive strength is below JEDEC specification.
5. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.
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