参数资料
型号: AGLE600V5-FG256
厂商: Microsemi SoC
文件页数: 104/166页
文件大小: 0K
描述: IC FPGA 1KB FLASH 600K 256-FBGA
标准包装: 90
系列: IGLOOe
逻辑元件/单元数: 13824
RAM 位总计: 110592
输入/输出数: 165
门数: 600000
电源电压: 1.425 V ~ 1.575 V
安装类型: 表面贴装
工作温度: 0°C ~ 70°C
封装/外壳: 256-LBGA
供应商设备封装: 256-FPBGA(17x17)
IGLOOe DC and Switching Characteristics
2-28
Revision 13
Detailed I/O DC Characteristics
Table 2-27 Input Capacitance
Symbol
Definition
Conditions
Min.
Max.
Units
CIN
Input capacitance
VIN = 0, f = 1.0 MHz
8
pF
CINCLK
Input capacitance on the clock pin
VIN = 0, f = 1.0 MHz
8
pF
Table 2-28 I/O Output Buffer Maximum Resistances1
Standard
Drive Strength
RPULL-DOWN ()2
RPULL-UP ()3
3.3 V LVTTL / 3.3 V LVCMOS
4 mA
100
300
8 mA
50
150
12 mA
25
75
16 mA
17
50
24 mA
11
33
3.3 V LVCMOS Wide Range
100 A
Same as regular
3.3 V LVCMOS
Same as regular
3.3 V LVCMOS
2.5 V LVCMOS
4 mA
100
200
8 mA
50
100
12 mA
25
50
16 mA
20
40
24 mA
11
22
1.8 V LVCMOS
2 mA
200
225
4 mA
100
112
6 mA
50
56
8 mA
50
56
12 mA
20
22
16 mA
20
22
1.5 V LVCMOS
2 mA
200
224
4 mA
100
112
6 mA
67
75
8 mA
33
37
12 mA
33
37
1.2 V LVCMOS4
2 mA
158
164
1.2 V LVCMOS Wide Range4
100 A
Same as regular
1.2 V LVCMOS
Same as regular
1.2 V LVCMOS
Notes:
1. These maximum values are provided for informational reasons only. Minimum output buffer resistance values depend
on VCCI, drive strength selection, temperature, and process. For board design considerations and detailed output buffer
resistances, use the corresponding IBIS models located on the Microsemi SoC Products Group website at
2. R(PULL-DOWN-MAX) = (VOLspec) / IOLspec
3. R(PULL-UP-MAX) = (VCCImax – VOHspec) / IOHspec
4. Applicable to IGLOOe V2 devices operating in the 1.2 V core range ONLY.
5. Output drive strength is below JEDEC specification.
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