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参数资料
型号： AGLN030V2-FUC81
元件分类： FPGA
英文描述： FPGA, PBGA81
封装： 4 X 4 MM, 0.80 MM HEIGHT, 0.40 MM PITCH, UCSP-81
文件页数： 38/114页
文件大小： 3991K
代理商： AGLN030V2-FUC81
IGLOO nano Low-Power Flash FPGAs
Advance v0.4
III
IGLOO nano Ordering Information
Notes:
1. Marking Information: IGLOO nano V2 devices do not have V2 marking, but IGLOO nano V5 devices are marked with a V5
designator.
2. The DC and switching characteristics for the –F speed grade targets are based only on simulation. The characteristics provided for
the –F speed grade are subject to change after establishing FPGA specifications. Some restrictions might be added and will be
reflected in future revisions of this document. The –F speed grade is only supported in the commercial temperature range.
3. For the AGLN060, AGLN125, and AGLN250, the Z feature grade does not support the enhanced nano features of Schmitt trigger
input, bus hold, cold-sparing, and hot-swap I/O capability. The AGLN030 Z feature grade does not support Schmitt trigger input
and bus hold. For the VQ100, CS81, UC81, QN68, and QN48 packages, the Z feature grade and the N part number are not marked
on the device.
AGLN010 = 10,000 System Gates
AGLN015 = 15,000 System Gates
AGLN020 = 20,000 System Gates
AGLN030 = 30,000 System Gates
AGLN060 = 60,000 System Gates
AGLN125 = 125,000 System Gates
AGLN250 = 250,000 System Gates
Speed Grade
Blank = Standard
F = 20% Slower than Standard
Feature Grade
Z = nano devices without enhanced features
Supply Voltage
2 = 1.2 V to 1.5 V
5 = 1.5 V only
AGLN250
V2
Z
VQ
_
Part Number
IGLOO nano Devices
Package Type
VQ = Very Thin Quad Flat Pack (0.5 mm pitch)
DIELOT = Known Good Die
QN = Quad Flat Pack No Leads (0.4 mm and 0.5 mm pitches)
100
I
Package Lead Count
G
Lead-Free Packaging
Application (Temperature Range)
Blank = Commercial (
–20°C to +70°C Ambient Temperature)
I= Industrial (
–40°C to +85°C Ambient Temperature)
Blank = Standard Packaging
G= RoHS-Compliant Packaging
PP = Pre-Production
ES =Engineering Sample (Room Temperature Only)
CS = Chip Scale Package (0.5 mm pitch)
UC = Micro Chip Scale Package (0.4 mm pitch)
3
2
相关PDF资料
PDF描述
AGLN030V2-FUCG81 FPGA, PBGA81
AGLN030V2-FVQ100 FPGA, PQFP100
AGLN030V2-FVQG100 FPGA, PQFP100
AGLN030V2-ZFCS81 FPGA, PBGA81
AGLN030V2-ZFCSG81 FPGA, PBGA81
相关代理商/技术参数
参数描述
AGLN030V2-ZCSG81 功能描述:IC FPGA NANO 1KB 30K 81-CSP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:IGLOO nano 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA，CSBGA 供应商设备封装:289-CSP（14x14）
AGLN030V2-ZCSG81I 功能描述:IC FPGA NANO 1KB 30K 81-CSP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:IGLOO nano 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA，CSBGA 供应商设备封装:289-CSP（14x14）
AGLN030V2-ZQNG48 功能描述:IC FPGA NANO 1KB 30K 48-QFN RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:IGLOO nano 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA，CSBGA 供应商设备封装:289-CSP（14x14）
AGLN030V2-ZQNG48I 功能描述:IC FPGA NANO 1KB 30K 48-QFN RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:IGLOO nano 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA，CSBGA 供应商设备封装:289-CSP（14x14）
AGLN030V2-ZQNG68 功能描述:IC FPGA NANO 1KB 30K 68-QFN RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:IGLOO nano 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA，CSBGA 供应商设备封装:289-CSP（14x14）
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