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型号： AGLP060V2-CS201
厂商： Microsemi SoC
文件页数： 44/134页
文件大小： 0K
描述： IC FPGA IGLOO PLUS 60K 201-CSP
标准包装： 384
系列： IGLOO PLUS
逻辑元件/单元数： 1584
RAM 位总计： 18432
输入/输出数： 157
门数： 60000
电源电压： 1.14 V ~ 1.575 V
安装类型： 表面贴装
工作温度： 0°C ~ 70°C
封装/外壳： 201-VFBGA，CSBGA
供应商设备封装： 201-CSP（8x8）
IGLOO PLUS Low Power Flash FPGAs
Revision 16
2-3
I/O Power-Up and Supply Voltage Thresholds for Power-On Reset
(Commercial and Industrial)
Sophisticated power-up management circuitry is designed into every IGLOO PLUS device. These
circuits ensure easy transition from the powered-off state to the powered-up state of the device. The
many different supplies can power up in any sequence with minimized current spikes or surges. In
addition, the I/O will be in a known state through the power-up sequence. The basic principle is shown in
Figure 2-1 on page 2-4.
There are five regions to consider during power-up.
IGLOO PLUS I/Os are activated only if ALL of the following three conditions are met:
1. VCC and VCCI are above the minimum specified trip points (Figure 2-1 and Figure 2-2 on
page 2-5).
2. VCCI > VCC – 0.75 V (typical)
3. Chip is in the operating mode.
VCCI Trip Point:
Ramping up (V5 devices): 0.6 V < trip_point_up < 1.2 V
Ramping down (V5 devices): 0.5 V < trip_point_down < 1.1 V
Ramping up (V2 devices): 0.75 V < trip_point_up < 1.05 V
Ramping down (V2 devices): 0.65 V < trip_point_down < 0.95 V
VCC Trip Point:
Ramping up (V5 devices): 0.6 V < trip_point_up < 1.1 V
Ramping down (V5 devices): 0.5 V < trip_point_down < 1.0 V
Ramping up (V2 devices): 0.65 V < trip_point_up < 1.05 V
Ramping down (V2 devices): 0.55 V < trip_point_down < 0.95 V
VCC and VCCI ramp-up trip points are about 100 mV higher than ramp-down trip points. This specifically
built-in hysteresis prevents undesirable power-up oscillations and current surges. Note the following:
During programming, I/Os become tristated and weakly pulled up to VCCI.
JTAG supply, PLL power supplies, and charge pump VPUMP supply have no influence on I/O
behavior.
Table 2-4 Overshoot and Undershoot Limits 1
VCCI
Average VCCI–GND Overshoot or
Undershoot Duration
as a Percentage of Clock Cycle2
Maximum Overshoot/
Undershoot2
2.7 V or less
10%
1.4 V
5%
1.49 V
3 V
10%
1.1 V
5%
1.19 V
3.3 V
10%
0.79 V
5%
0.88 V
3.6 V
10%
0.45 V
5%
0.54 V
Notes:
1. Based on reliability requirements at 85°C.
2. The duration is allowed at one out of six clock cycles. If the overshoot/undershoot occurs at one out of two cycles, the
maximum overshoot/undershoot has to be reduced by 0.15 V.
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相关代理商/技术参数
参数描述
AGLP060V2-CS201I 功能描述:IC FPGA IGLOO PLUS 60K 201-CSP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:IGLOO PLUS 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA，CSBGA 供应商设备封装:289-CSP（14x14）
AGLP060-V2CS289 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:IGLOO PLUS Low-Power Flash FPGAs with FlashFreeze Technology
AGLP060V2-CS289 功能描述:IC FPGA IGLOO PLUS 60K 289-CSP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:IGLOO PLUS 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA，CSBGA 供应商设备封装:289-CSP（14x14）
AGLP060-V2CS289ES 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:IGLOO PLUS Low-Power Flash FPGAs with FlashFreeze Technology
AGLP060-V2CS289I 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:IGLOO PLUS Low-Power Flash FPGAs with FlashFreeze Technology
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