参数资料
型号: AGLP060V2-CS289I
厂商: Microsemi SoC
文件页数: 53/134页
文件大小: 0K
描述: IC FPGA IGLOO PLUS 60K 289-CSP
标准包装: 152
系列: IGLOO PLUS
逻辑元件/单元数: 1584
RAM 位总计: 18432
输入/输出数: 157
门数: 60000
电源电压: 1.14 V ~ 1.575 V
安装类型: 表面贴装
工作温度: -40°C ~ 85°C
封装/外壳: 289-TFBGA,CSBGA
供应商设备封装: 289-CSP(14x14)
IGLOO PLUS Low Power Flash FPGAs
Revision 16
2-11
Table 2-16 Different Components Contributing to the Static Power Consumption in IGLOO PLUS Devices
For IGLOO PLUS V2 or V5 Devices, 1.5 V Core Supply Voltage
Parameter
Definition
Device-Specific Static Power (mW)
AGLP125
AGLP060
AGLP030
PDC1
Array static power in Active mode
PDC2
Array static power in Static (Idle) mode
PDC3
Array static power in Flash*Freeze mode
PDC4
Static PLL contribution
1.841
PDC5
Bank quiescent power (VCCI-dependent)
Notes:
1. This is the minimum contribution of the PLL when operating at lowest frequency.
2. For a different output load, drive strength, or slew rate, Microsemi recommends using the Microsemi power spreadsheet
calculator or the SmartPower tool in Libero SoC software.
Table 2-17 Different Components Contributing to Dynamic Power Consumption in IGLOO PLUS Devices
For IGLOO PLUS V2 Devices, 1.2 V Core Supply Voltage
Parameter
Definition
Device-Specific Dynamic Power
(W/MHz)
AGLP125 AGLP060 AGLP030
PAC1
Clock contribution of a Global Rib
2.874
1.727
0.0001
PAC2
Clock contribution of a Global Spine
1.264
1.244
2.241
PAC3
Clock contribution of a VersaTile row
0.963
0.975
0.981
PAC4
Clock contribution of a VersaTile used as a sequential module
0.098
0.096
PAC5
First contribution of a VersaTile used as a sequential module
0.018
PAC6
Second contribution of a VersaTile used as a sequential module
0.203
PAC7
Contribution of a VersaTile used as a combinatorial module
0.160
0.170
0.158
PAC8
Average contribution of a routing net
0.679
0.686
0.748
PAC9
Contribution of an I/O input pin (standard-dependent)
PAC10
Contribution of an I/O output pin (standard-dependent)
PAC11
Average contribution of a RAM block during a read operation
25.00
PAC12
Average contribution of a RAM block during a write operation
30.00
PAC13
Dynamic contribution for PLL
2.10
Note: 1. There is no Center Global Rib present in AGLP030, and thus it starts directly at the spine resulting in
0W/MHz.
相关PDF资料
PDF描述
PCA24S08ADP,118 IC EEPROM 8KBIT 400KHZ 8TSSOP
AGLP060V2-CSG289I IC FPGA IGLOO PLUS 60K 289-CSP
EX256-TQ100I IC FPGA ANTIFUSE 12K 100-TQFP
EX256-TQG100I IC FPGA ANTIFUSE 12K 100-TQFP
A54SX16A-FPQ208 IC FPGA SX 24K GATES 208-PQFP
相关代理商/技术参数
参数描述
AGLP060-V2CS289PP 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:IGLOO PLUS Low-Power Flash FPGAs with FlashFreeze Technology
AGLP060V2-CSG201 功能描述:IC FPGA IGLOO PLUS 60K 201-CSP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:IGLOO PLUS 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA,CSBGA 供应商设备封装:289-CSP(14x14)
AGLP060V2-CSG201I 功能描述:IC FPGA IGLOO PLUS 60K 201-CSP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:IGLOO PLUS 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA,CSBGA 供应商设备封装:289-CSP(14x14)
AGLP060-V2CSG289 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:IGLOO PLUS Low-Power Flash FPGAs with FlashFreeze Technology
AGLP060V2-CSG289 功能描述:IC FPGA IGLOO PLUS 60K 289-CSP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:IGLOO PLUS 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA,CSBGA 供应商设备封装:289-CSP(14x14)