收藏本站
参数资料
型号： AGLP125V5-CS289I
厂商： Microsemi SoC
文件页数： 134/134页
文件大小： 0K
描述： IC FPGA IGLOO PLUS 125K 289-CSP
标准包装： 152
系列： IGLOO PLUS
逻辑元件/单元数： 3120
RAM 位总计： 36864
输入/输出数： 212
门数： 125000
电源电压： 1.425 V ~ 1.575 V
安装类型： 表面贴装
工作温度： -40°C ~ 85°C
封装/外壳： 289-TFBGA，CSBGA
供应商设备封装： 289-CSP（14x14）
IGLOO PLUS Low Power Flash FPGAs
Revision 16
3-5
Special Function Pins
NC
No Connect
This pin is not connected to circuitry within the device. These pins can be driven to any voltage or can be
left floating with no effect on the operation of the device.
DC
Do Not Connect
This pin should not be connected to any signals on the PCB. These pins should be left unconnected.
Packaging
Semiconductor technology is constantly shrinking in size while growing in capability and functional
integration. To enable next-generation silicon technologies, semiconductor packages have also evolved
to provide improved performance and flexibility.
Microsemi consistently delivers packages that provide the necessary mechanical and environmental
protection to ensure consistent reliability and performance. Microsemi IC packaging technology
efficiently supports high-density FPGAs with large-pin-count Ball Grid Arrays (BGAs), but is also flexible
enough to accommodate stringent form factor requirements for Chip Scale Packaging (CSP). In addition,
Microsemi offers a variety of packages designed to meet your most demanding application and economic
requirements for today's embedded and mobile systems.
Related Documents
IGLOO PLUS Device Family User’s Guide
http://www.microsemi.com/soc/documents/IGLOOPLUS_UG.pdf
The following documents provide packaging information and device selection for low power flash
devices.
Product Catalog
http://www.microsemi.com/soc/documents/ProdCat_PIB.pdf
Lists devices currently recommended for new designs and the packages available for each member of
the family. Use this document or the datasheet tables to determine the best package for your design, and
which package drawing to use.
Package Mechanical Drawings
http://www.microsemi.com/soc/documents/PckgMechDrwngs.pdf
This document contains the package mechanical drawings for all packages currently or previously
supplied by Microsemi. Use the bookmarks to navigate to the package mechanical drawings.
Additional packaging materials are available at
http://www.microsemi.com/soc/products/solutions/package/docs.aspx.
相关PDF资料
PDF描述
A40MX02-2PLG44 IC FPGA MX SGL CHIP 3K 44-PLCC
A40MX04-PL84 IC FPGA MX SGL CHIP 6K 84-PLCC
EPF8452AQC160-3 IC FLEX 8000A FPGA 4K 160-PQFP
HMC35DRYI-S93 CONN EDGECARD 70POS DIP .100 SLD
APA075-FG144 IC FPGA PROASIC+ 75K 144-FBGA
相关代理商/技术参数
参数描述
AGLP125-V5CS289PP 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:IGLOO PLUS Low-Power Flash FPGAs with FlashFreeze Technology
AGLP125V5-CSG281 功能描述:IC FPGA IGLOO PLUS 125K 281-CSP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:IGLOO PLUS 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA，CSBGA 供应商设备封装:289-CSP（14x14）
AGLP125V5-CSG281I 功能描述:IC FPGA IGLOO PLUS 125K 281-CSP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:IGLOO PLUS 标准包装:90 系列:ProASIC3 LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:36864 输入/输出数:157 门数:250000 电源电压:1.425 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 125°C 封装/外壳:256-LBGA 供应商设备封装:256-FPBGA（17x17）
AGLP125-V5CSG289 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:IGLOO PLUS Low-Power Flash FPGAs with FlashFreeze Technology
AGLP125V5-CSG289 功能描述:IC FPGA IGLOO PLUS 125K 289-CSP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:IGLOO PLUS 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA，CSBGA 供应商设备封装:289-CSP（14x14）
发布紧急采购，3分钟左右您将得到回复。

采购需求

(若只采购一条型号，填写一行即可)

发布成功！您可以继续发布采购。也可以进入我的后台，查看报价

发布成功！您可以继续发布采购。也可以进入我的后台，查看报价

*型号 *数量 厂商 批号 封装
添加更多采购

我的联系方式

*
*
*