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参数资料
型号： AGLP125V5-CSG281
元件分类： FPGA
英文描述： FPGA, 3120 CLBS, 125000 GATES, PBGA281
封装： 10 X 10 MM, 1.05 MM HEIGHT, 0.5 MM PITCH, ROHS COMPLIANT, CSP-281
文件页数： 42/128页
文件大小： 4383K
代理商： AGLP125V5-CSG281
IGLOO PLUS DC and Switching Characteristics
2- 6
R ev isio n 1 1
Thermal Characteristics
Introduction
The temperature variable in the Actel Designer software refers to the junction temperature, not the
ambient temperature. This is an important distinction because dynamic and static power consumption
cause the chip junction temperature to be higher than the ambient temperature.
EQ 1 can be used to calculate junction temperature.
TJ = Junction Temperature = ΔT + TA
EQ 1
where:
TA = Ambient temperature
ΔT = Temperature gradient between junction (silicon) and ambient ΔT = θ
ja * P
θ
ja = Junction-to-ambient of the package. θja numbers are located in Figure 2-5.
P = Power dissipation
Package Thermal Characteristics
The device junction-to-case thermal resistivity is
θ
jc and the junction-to-ambient air thermal resistivity is
θ
ja. The thermal characteristics for θja are shown for two air flow rates. The maximum operating junction
temperature is 100°C. EQ 2 shows a sample calculation of the maximum operating power dissipation
allowed for a 484-pin FBGA package at commercial temperature and in still air.
EQ 2
Temperature and Voltage Derating Factors
Maximum Power Allowed
Max. junction temp. (
°C) Max. ambient temp. (°C)
–
θ
ja(°C/W)
------------------------------------------------------------------------------------------------------------------------------------------
100
°C70°C
–
20.5°C/W
-------------------------------------
1.46 W
=
Table 2-5 Package Thermal Resistivities
Package Type
Pin
Count
θ
jc
θ
ja
Units
Still Air
200 ft./
min.
500 ft./
min.
Chip Scale Package (CSP)
201
TBD
C/W
281
TBD
C/W
289
TBD
C/W
Very Thin Quad Flat Package (VQFP)
128
TBD
C/W
176
TBD
C/W
Table 2-6 Temperature and Voltage Derating Factors for Timing Delays (normalized to TJ = 70°C,
VCC =1.425 V)
For IGLOO PLUS V2 or V5 devices, 1.5 V DC Core Supply Voltage
Array Voltage
VCC (V)
Junction Temperature (°C)
–40°C
0°C
25°C
70°C
85°C
100°C
1.425
0.934
0.953
0.971
1.000
1.007
1.013
1.5
0.855
0.874
0.891
0.917
0.924
0.929
1.575
0.799
0.816
0.832
0.857
0.864
0.868
相关PDF资料
PDF描述
AGLP125V5-CSG289I FPGA, 3120 CLBS, 125000 GATES, PBGA289
AGLP125V5-CSG289 FPGA, 3120 CLBS, 125000 GATES, PBGA289
AGLP125V5CS281I FPGA, 3120 CLBS, 125000 GATES, PBGA281
AGLP125V5CS281 FPGA, 3120 CLBS, 125000 GATES, PBGA281
AGLP125V5CS289I FPGA, 3120 CLBS, 125000 GATES, PBGA289
相关代理商/技术参数
参数描述
AGLP125V5-CSG281I 功能描述:IC FPGA IGLOO PLUS 125K 281-CSP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:IGLOO PLUS 标准包装:90 系列:ProASIC3 LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:36864 输入/输出数:157 门数:250000 电源电压:1.425 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 125°C 封装/外壳:256-LBGA 供应商设备封装:256-FPBGA（17x17）
AGLP125-V5CSG289 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:IGLOO PLUS Low-Power Flash FPGAs with FlashFreeze Technology
AGLP125V5-CSG289 功能描述:IC FPGA IGLOO PLUS 125K 289-CSP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:IGLOO PLUS 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA，CSBGA 供应商设备封装:289-CSP（14x14）
AGLP125-V5CSG289ES 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:IGLOO PLUS Low-Power Flash FPGAs with FlashFreeze Technology
AGLP125-V5CSG289I 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:IGLOO PLUS Low-Power Flash FPGAs with FlashFreeze Technology
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