参数资料
型号: AGLP125V5-CSG281I
厂商: Microsemi SoC
文件页数: 13/134页
文件大小: 0K
描述: IC FPGA IGLOO PLUS 125K 281-CSP
标准包装: 184
系列: IGLOO PLUS
逻辑元件/单元数: 3120
RAM 位总计: 36864
输入/输出数: 212
门数: 125000
电源电压: 1.425 V ~ 1.575 V
安装类型: 表面贴装
工作温度: -40°C ~ 85°C
封装/外壳: 281-TFBGA,CSBGA
供应商设备封装: 281-CSP(10x10)
IGLOO PLUS Low Power Flash FPGAs
Revision 16
1-5
VersaTiles
The IGLOO PLUS core consists of VersaTiles, which have been enhanced beyond the ProASICPLUS
core tiles. The IGLOO PLUS VersaTile supports the following:
All 3-input logic functions—LUT-3 equivalent
Latch with clear or set
D-flip-flop with clear or set
Enable D-flip-flop with clear or set
Refer to Figure 1-3 for VersaTile configurations.
User Nonvolatile FlashROM
IGLOO PLUS devices have 1 kbit of on-chip, user-accessible, nonvolatile FlashROM. The FlashROM
can be used in diverse system applications:
Internet protocol addressing (wireless or fixed)
System calibration settings
Device serialization and/or inventory control
Subscription-based business models (for example, set-top boxes)
Secure key storage for secure communications algorithms
Asset management/tracking
Date stamping
Version management
The FlashROM is written using the standard IGLOO PLUS IEEE 1532 JTAG programming interface. The
core can be individually programmed (erased and written), and on-chip AES decryption can be used
selectively to securely load data over public networks (except in AGLP030 devices), as in security keys
stored in the FlashROM for a user design.
The FlashROM can be programmed via the JTAG programming interface, and its contents can be read
back either through the JTAG programming interface or via direct FPGA core addressing. Note that the
FlashROM can only be programmed from the JTAG interface and cannot be programmed from the
internal logic array.
The FlashROM is programmed as 8 banks of 128 bits; however, reading is performed on a byte-by-byte
basis using a synchronous interface. A 7-bit address from the FPGA core defines which of the 8 banks
and which of the 16 bytes within that bank are being read. The three most significant bits (MSBs) of the
FlashROM address determine the bank, and the four least significant bits (LSBs) of the FlashROM
address define the byte.
The IGLOO PLUS development software solutions, Libero System-on-Chip (SoC) and Designer, have
extensive support for the FlashROM. One such feature is auto-generation of sequential programming
files for applications requiring a unique serial number in each part. Another feature allows the inclusion of
static data for system version control. Data for the FlashROM can be generated quickly and easily using
Libero SoC and Designer software tools. Comprehensive programming file support is also included to
allow for easy programming of large numbers of parts with differing FlashROM contents.
Figure 1-3 VersaTile Configurations
X1
Y
X2
X3
LUT-3
Data
Y
CLK
Enable
CLR
D-FF
Data
Y
CLK
CLR
D-FF
LUT-3 Equivalent
D-Flip-Flop with Clear or Set
Enable D-Flip-Flop with Clear or Set
相关PDF资料
PDF描述
A54SX08A-TQG100 IC FPGA 130I/O 100TQFP
M1A3P600L-FG144 IC FPGA 1KB FLASH 600K 144-FBGA
R1EX24128BTAS0A#S0 IC EEPROM 128K 400KHZ 8TSSOP
RMA50DRSD-S288 CONN EDGECARD 100POS .125 EXTEND
HSM36DSAI CONN EDGECARD 72POS R/A .156 SLD
相关代理商/技术参数
参数描述
AGLP125-V5CSG289 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:IGLOO PLUS Low-Power Flash FPGAs with FlashFreeze Technology
AGLP125V5-CSG289 功能描述:IC FPGA IGLOO PLUS 125K 289-CSP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:IGLOO PLUS 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA,CSBGA 供应商设备封装:289-CSP(14x14)
AGLP125-V5CSG289ES 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:IGLOO PLUS Low-Power Flash FPGAs with FlashFreeze Technology
AGLP125-V5CSG289I 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:IGLOO PLUS Low-Power Flash FPGAs with FlashFreeze Technology
AGLP125V5-CSG289I 功能描述:IC FPGA IGLOO PLUS 125K 289-CSP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:IGLOO PLUS 标准包装:90 系列:ProASIC3 LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:36864 输入/输出数:157 门数:250000 电源电压:1.425 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 125°C 封装/外壳:256-LBGA 供应商设备封装:256-FPBGA(17x17)