参数资料
型号: AH114
厂商: TRIQUINT SEMICONDUCTOR INC
元件分类: 放大器
英文描述: 400 MHz - 2500 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER
封装: SMT, SOT-89, 3 PIN
文件页数: 4/4页
文件大小: 223K
代理商: AH114
This document contains information on a new product.
Specifications and information are subject to change without notice
WJ Communications, Inc
Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com
October 2003
The Communications Edge TM
AH114
Watt, High Linearity InGaP HBT Amplifier
Advanced Data Sheet
Outline Drawing
Land Pattern
Product Marking
The component will be marked with an “AH114”
designator with a four- or five-digit alphanumeric lot
code on the top surface of the package. Tape and reel
specification for this part is located on the website in
the “Application Notes” section.
ESD / MSL Information
ESD Classification: Class 1A
Test:
Human Body Model (HBM)
Standard:
JEDEC Standard JESD22-A114
MSL Rating:
Level 3
Standard:
JEDEC Standard J-STD-020A
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper
performance of this device. Vias should use a .35mm
(#80 / .0135”) diameter drill and have a final plated
thru diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer
layers near the part to ensure optimal thermal
performance.
3. Mounting screws can be added near the part to fasten
the board to a heatsink. Ensure that the ground /
thermal via region contacts the heatsink.
4. Do not put solder mask on the backside of the PC
board in the region where the board contacts the
heatsink.
5. RF trace width depends upon the PC board material
and construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles
are in degrees.
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